# US 9,040,227 B2 · Microstructure manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,040,227 B2 - Document ID: US9040227B2 - Status: Granted - Kind: B2 - Application number: 13/399,651 - Filed: 2012-02-17 - Published: 2012-08-30 - Granted: 2015-05-26 - Earliest claimed: 2011-02-24 - Assignees: Canon Kabushiki Kaisha - Applicants: Takayuki Teshima; Yutaka Setomoto - Inventors: Takayuki Teshima; Yutaka Setomoto - Web page: https://patentgrep.com/patent/US9040227B2 ## CPC - C25D 5/12: at least one layer being of nickel or chromium - A61B 6/4233: {using matrix detectors} - A61B 6/484: {involving phase contrast X-ray imaging} - C23C 18/1605: {by masking} - C23C 18/1651: {Two or more layers only obtained by electroless plating} - C25D 5/022: {using masking means} - C25D 5/10: Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) - C25D 5/615: {Microstructure of the layers, e.g. mixed structure} - G02B 5/18: Diffraction gratings {(holographic optical elements G02B5/32, G03H; integrally combined with optical fibres G02B6/02057; for coupling light guides G02B6/34; integrally combined with optical integrated light guides G02B6/12; grating systems G02B27/44)} - G21K 1/10: Scattering devices; Absorbing devices; Ionising radiation filters - A61B 6/4291: {the detector being combined with a grid or grating} - C25D 3/12: of nickel or cobalt - C25D 3/38: of copper - C25D 3/48: of gold - C25D 7/123: {Semiconductors first coated with a seed layer or a conductive layer} - G03F 7/40: Treatment after imagewise removal, e.g. baking - G21K 2207/005: Methods and devices obtaining contrast from non-absorbing interaction of the radiation with matter, e.g. phase contrast - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G21K: HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract A microstructure manufacturing method includes forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity, forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface, forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution, curing the structure of the photosensitive resin after forming the first plated layer, removing at least part of the first plated layer after curing the structure of the photosensitive resin, and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution. ## Claims ### Claim 1 A microstructure manufacturing method comprising: forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity; exposing a pattern on the layer of the photosensitive resin to light; developing the layer of the photosensitive resin to form a structure of the photosensitive resin that exposes a part of the substrate surface; forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution; curing the structure of the photosensitive resin by at least one of exposing the structure to light and heating the structure, after forming the first plated layer; removing at least part of the first plated layer after curing the structure of the photosensitive resin; and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution, wherein the second plated layer and any remaining part of the first plated layer form the microstructure, wherein the photosensitive resin is a negative photosensitive resin, and wherein the aspect ratio of a concave portion of the microstructure is 12 or more and 100 or less. ### Claim 2 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the exposed photosensitive resin has an etching resistance against the first plating solution, and wherein the cured photosensitive resin has an etching resistance against the second plating solution. ### Claim 3 (depends on 1) The microstructure manufacturing method according to claim 1, wherein an etching resistance of the exposed photosensitive resin against the first plating solution is higher than an etching resistance of the exposed photosensitive resin against the second plating solution, and wherein the cured photosensitive resin has a higher etching resistance against the second plating solution than the exposed photosensitive resin. ### Claim 4 (depends on 1) The microstructure manufacturing method according to claim 1, further comprising exposing the substrate surface by removing the entire first plated layer, and wherein the second plated layer is formed on part of the substrate surface exposed by removing the entire first plated layer. ### Claim 5 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the second plated layer is formed on the first plated layer remained on the substrate surface. ### Claim 6 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the substrate surface consists essentially of gold. ### Claim 7 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the first plated layer consists essentially of nickel, copper, iron, tin or an alloy of them. ### Claim 8 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the second plated layer consists essentially of gold. ### Claim 9 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the photosensitive resin is a thermosetting resin, and wherein the structure of the photosensitive resin is cured by heating. ### Claim 10 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the layer of the photosensitive resin is exposed to synchrotron radiation light. ### Claim 11 (depends on 1) The microstructure manufacturing method according to claim 1, wherein the microstructure is an X-ray absorption grating.