# US 9,039,941 B2 · Conductive paste for screen printing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,039,941 B2 - Document ID: US9039941B2 - Status: Granted - Kind: B2 - Application number: 13/499,122 - Filed: 2010-12-21 - Published: 2013-02-28 - Granted: 2015-05-26 - Earliest claimed: 2009-12-22 - Assignees: DIC Corporation - Applicants: Shou Inagaki; Hideki Etori; Hiroshi Isozumi; Masanori Kasai - Inventors: Shou Inagaki; Hideki Etori; Hiroshi Isozumi; Masanori Kasai - Web page: https://patentgrep.com/patent/US9039941B2 ## CPC - H01B 1/22: the conductive material comprising metals or alloys - B22F 1/0545: Dispersions or suspensions of nanosized particles - B22F 1/102: Metallic powder coated with organic material - B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites - C09D 11/03: characterised by features other than the chemical nature of the binder - C09D 11/037: characterised by the pigment - C09D 11/52: Electrically conductive inks - H01B 1/02: mainly consisting of metals or alloys - B05D 5/12: to obtain a coating with specific electrical properties - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) ## Abstract There is provided a conductive paste for screen printing. The conductive paste includes: metal nanoparticles (Y) having an average particle diameter of 1 to 50 nm and protected with a polymer compound having a branched polyalkyleneimine chain and a polymer chain selected from the group consisting of a polyoxyalkylene chain, a polymer chain composed of a polyvinyl alcohol, a polymer chain composed of a water-soluble poly(meth)acrylic acid, a polyacylalkyleneimine chain having a hydrophilic substituent, and a polymer chain composed of a polyacrylamide; metal particles (Z) having an average particle diameter of 200 to 600 nm; a deprotecting agent (A) for the metal nanoparticles; and an organic solvent (B). An aliphatic monocarboxylic acid having 6 to 10 carbon atoms is used as the deprotecting agent (A) for the metal nanoparticles. A polyalkylene glycol is used as the organic solvent (B). ## Claims ### Claim 1 A method to produce a circuit pattern by using a conductive paste for screen printing, comprising; providing the conductive paste, wherein the conductive paste comprises: metal nanoparticles (Y) having an average particle diameter of 1 to 50 nm and having a surface coated with a polymer compound having a branched polyalkyleneimine chain and a polymer chain selected from the group consisting of a polyoxyalkylene chain, a polymer chain composed of a polyvinyl alcohol, a polymer chain composed of a water-soluble poly(meth)acrylic acid, a polyacylalkyleneimine chain having a hydrophilic substituent, and a polymer chain composed of a polyacrylamide; metal particles (Z) having an average particle diameter of 200 to 600 nm; an aliphatic monocarboxylic acid having 6 to 10 carbon atoms; and an organic solvent (B), wherein a polyalkylene glycol is used as the organic solvent (B), printing the conductive paste on a substrate, and baking the conductive paste at a temperature of 150° C. or lower to form a circuit pattern having a resistivity on the order of 10−6 Ωcm. ### Claim 2 (depends on 1) The method according to claim 1, wherein the aliphatic monocarboxylic acid having 6 to 10 carbon atoms is caprylic acid. ### Claim 3 (depends on 1) The method according to claim 1, wherein the polyalkylene glycol is triethylene glycol. ### Claim 4 (depends on 1) The method according to claim 1, wherein a total nonvolatile content of the metal nanoparticles (Y) and the metal particles (Z) is 70% to 95% on a mass basis. ### Claim 5 (depends on 1) The method according to claim 1, wherein the circuit pattern is included in an electric or electronic component. ### Claim 6 (depends on 2) The method according to claim 2, wherein the circuit pattern is included in an electric or electronic component. ### Claim 7 (depends on 3) The method according to claim 3, wherein the circuit pattern is included in an electric or electronic component. ### Claim 8 (depends on 4) The method according to claim 4, wherein the circuit pattern is included in an electric or electronic component. ### Claim 9 (depends on 1) The method according to claim 1, wherein the polyacylalkyleneimine chain having hydrophilic substituents is one selected from the group consisting of polyacetylethyleneimine, polyacetylpropyleneimine, polypropionylethyleneimine, and polypropionylpropyleneimine. ### Claim 10 (depends on 1) The method according to claim 1, wherein the substrate is a flexible substrate made of polyethylene terephthalate, polyethylene naphthalate or polycarbonate.