# US 9,039,867 B2 · Method for detaching a semiconductor chip from a foil

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- Number: US 9,039,867 B2
- Document ID: US9039867B2
- Status: Granted
- Kind: B2
- Application number: 13/839,586
- Filed: 2013-03-15
- Published: 2013-10-03
- Granted: 2015-05-26
- Earliest claimed: 2012-03-30
- Assignees: Besi Switzerland AG
- Applicants: Besi Switzerland AG
- Inventors: Ernst Barmettler; Fabian Hurschler; Brian Pulis
- Web page: https://patentgrep.com/patent/US9039867B2

## CPC

- H10P 72/00: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape}
- H10P 72/33: {into and out of processing chamber}
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- Y10S 156/931: Peeling away backing
- Y10S 156/932: with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
- Y10S 156/943: with poking delaminating means, e.g. jabbing means
- Y10T 156/1168: Gripping and pulling work apart during delaminating
- Y10T 156/1179: with poking during delaminating [e.g., jabbing, etc.]
- Y10T 156/1983: Poking delaminating means
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.

## Claims

### Claim 1

A method for detaching a semiconductor chip from a foil by means of a chip gripper and a die ejector, wherein the die ejector comprises a first plurality plates having a straight supporting edge and a second plurality of plates having an L-shaped supporting edge, a first set of two of the second plurality of plates are arranged to form a first pair of outermost plates, the first plurality of plates and the second plurality of plates protruding into a central hole of a cover plate, and wherein the supporting edges of the first plurality of plates and the second plurality of plates in an initial position form a supporting plane on which the foil rests, the method comprising the following steps:
A) lifting all of the first plurality of plates and the second plurality of plates, so that the supporting edges of the first plurality of plates and the second plurality of plates assume a height H1 above a surface of the cover plate;
B) lowering the first pair of outermost plates leaving a first group of plates raised;
C) lifting the first group of plates, so that the supporting edges of the first group of plates assume a height H2>H1 above the surface of the cover plate;
D) lowering some but not all of the first group of plates in a predetermined sequence leaving a last group of at least three plates from the first group of plates;
E) positioning the chip gripper above the semiconductor chip;
F) lowering the chip gripper into contact with the semiconductor chip before the lowering of the last group of at least three plates; and
G) lowering the last group of at least three plates until all of the last group of at least three plates are lowered, wherein steps A to D are executed in the order listed above and before steps F and G.

### Claim 2 (depends on 1)

The method of claim 1, wherein:
the first plurality of plates and the second plurality of plates are fixed to a carrier;
the carrier is configured to be displaceable perpendicularly to the surface of the cover plate;
the first plurality of plates and the second plurality of plates are configured to be lifted and lowered relative to the carrier;
the carrier is disposed in an initial predetermined position z0 and the first plurality of plates and the second plurality of plates are configured to be lifted relative to the carrier, so that the supporting edges of the first plurality of plates and the second plurality of plates form a supporting plane on which the foil rests, and wherein the method further comprises:
lifting the carrier a predetermined distance Δz1 in step A; and
lifting the carrier a predetermined distance Δz2 in step C.

### Claim 3 (depends on 1)

The method of claim 1, wherein a second set of two of the second plurality of plates is arranged to form a second pair of second outermost plates, the method further comprising:
after step B, lowering the second pair of second outermost plates of the second plates.

### Claim 4 (depends on 1)

The method of claim 1, further comprising:
after step D, lowering the last group of at least three plates, so that the supporting edges of the last group of at least three plates assume a height H3<H2 above the surface of the cover plate.

### Claim 5 (depends on 4)

The method of claim 4, wherein:
the first plurality of plates and the second plurality of plates are fixed to a carrier;
the carrier is configured to be displaceable perpendicularly to the surface of the cover plate;
the first plurality of plates and the second plurality of plates are configured to be lifted and lowered relative to the carrier;
the carrier is disposed in an initial predetermined position z0 and the plates are configured to be lifted relative to the carrier, so that the supporting edges of the first plurality of plates and the second plurality of plates form a supporting plane on which the foil rests, and wherein the method further comprises:
lifting the carrier a predetermined distance Δz1 in step A;
lifting the carrier a predetermined distance Δz2 in step C; and
lowering the carrier a predetermined distance Δz3 in the ‘after step D’ step.