# US 9,039,866 B2 · Method of manufacturing conductive structures > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,039,866 B2 - Document ID: US9039866B2 - Status: Granted - Kind: B2 - Application number: 13/666,498 - Filed: 2012-11-01 - Published: 2013-03-07 - Granted: 2015-05-26 - Earliest claimed: 2010-06-14 - Assignees: Avery Dennison Corporation - Applicants: Ian J. Forster; Christian K. Oelsner; Robert Revels; Benjamin Kingston; Peter Cockerell; Norman Howard - Inventors: Ian J. Forster; Christian K. Oelsner; Robert Revels; Benjamin Kingston; Peter Cockerell; Norman Howard - Web page: https://patentgrep.com/patent/US9039866B2 ## CPC - H01P 11/003: {Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines} - B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove - B32B 38/10: Removing layers, or parts of layers, mechanically or chemically - G06K 19/0723: {the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs} - G06K 19/07718: {the record carrier being manufactured in a continuous process, e.g. using endless rolls} - G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card} - G06K 19/0775: {arrangements for connecting the integrated circuit to the antenna} - G06K 19/07754: {the connection being galvanic} - G06K 19/07786: {the antenna being of the HF type, such as a dipole} - B32B 37/12: characterised by using adhesives - B32B 38/145: {Printing} - B32B 2305/10: Fibres of continuous length - B32B 2307/302: Conductive - B32B 2317/12: Paper, e.g. cardboard - B32B 2519/02: RFID tags - Y10T 29/49016: Antenna or wave energy "plumbing" making - Y10T 29/49018: with other electrical component - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49156: with selective destruction of conductive paths - Y10T 29/5317: Laminated device - Y10T 29/53174: Means to fasten electrical component to wiring board, base, or substrate - Y10T 156/1052: with cutting, punching, tearing or severing - Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] - Y10T 428/24917: including metal layer - Y10T 428/2809: including irradiated or wave energy treated component - Y10T 428/2817: Heat sealable - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed. ## Claims ### Claim 1 A method of making a web of conductive structures: providing a substrate having first and second faces; providing an adhesive layer over the first face of the substrate, the adhesive layer including a plurality of optical brighteners; providing a plurality of registration marks on the adhesive layer; deadening areas of the adhesive layer by a UV source to create active areas where adhesive is tacking and deadened areas where the adhesive is non-tacky; laminating a conductive layer over the adhesive layer such that the conductive layer adheres to the active areas of the adhesive layer; and detecting the registration marks; and cutting the conductive layer bonded to the substrate to form a plurality of conductive structures so that each of the conductive structures are aligned with at least one of the plurality registration marks. ### Claim 2 (depends on 1) The method of claim 1, wherein the registration marks include optical brighteners. ### Claim 3 (depends on 1) The method of claim 1, including a further step of creating variable or personalized patterns in the conductive layer. ### Claim 4 (depends on 1) The method of claim 1, wherein the conductive structures are formed by one of a laser cutter or cold foil process. ### Claim 5 (depends on 1) The method of claim 1, wherein the adhesive layer is provided in pattern. ### Claim 6 (depends on 5) The method of claim 5, wherein the pattern corresponds to shapes of the conductive structures. ### Claim 7 (depends on 1) The method of claim 1, wherein the conductive layer is constructed from a metal foil. ### Claim 8 A method of producing a web having a plurality of RFID antennas: providing a substrate having first and second faces; providing a cutting mechanism; printing registration marks along edges of the substrate on one of the first and second faces; applying an adhesive layer on the first face of the substrate, the adhesive layer includes a plurality of optical brighteners; deadening areas of the adhesive layer by a UV source to create active areas where portions of the adhesive layer is tacky and deadened areas where other portions of the adhesive layer is non-tacky; placing a conductive layer over the adhesive layer; laminating the conductive layer over the adhesive layer such that the conductive layer adheres to active areas of the adhesive layer and does not adhere to deadened areas of the adhesive layer by a UV source; detecting the plurality of optical brighteners; and creating at least one pattern by one of laser cutting, die cutting or cold foil process in the conductive layer for forming a conductive structure after detecting the plurality of optical brighteners. ### Claim 9 (depends on 8) The method of claim 8, wherein the optical brightener is UV detectable. ### Claim 10 (depends on 8) The method of claim 8, including a further step of removing portions of the conductive layer not adhered to the deadened areas of the adhesive layer after the step of laminating the conductive layer. ### Claim 11 (depends on 8) The method of claim 8, wherein the at least one pattern is a variable or personalized pattern. ### Claim 12 (depends on 8) The method of claim 8, wherein the optical brightener is printed on top of the adhesive layer. ### Claim 13 (depends on 8) The method of claim 8, wherein the optical brightener is a fluorescent powder. ### Claim 14 (depends on 8) The method of claim 8, wherein the adhesive layer is provided in a pattern corresponding to the at least one pattern.