# US 9,039,859 B2 · Method for manufacturing monolithic ceramic electronic components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,039,859 B2 - Document ID: US9039859B2 - Status: Granted - Kind: B2 - Application number: 13/759,177 - Filed: 2013-02-05 - Published: 2013-08-08 - Granted: 2015-05-26 - Earliest claimed: 2012-02-07 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Junya Tanaka; Hironori Tsutsumi - Web page: https://patentgrep.com/patent/US9039859B2 ## CPC - B32B 38/0004: {Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence)} - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - B26D 1/147: with horizontal cutting member - B26D 1/15: with vertical cutting member - B32B 2315/02: Ceramics - C04B 2237/32: Ceramic - C04B 2237/40: Metallic - H01G 4/0085: {Fried electrodes} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - Y10T 156/1052: with cutting, punching, tearing or severing - Y10T 156/1075: of plural laminae from single stock and assembling to each other or to additional lamina - Y10T 156/1348: Work traversing type - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - B26D: CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING (for growing crops or plants A01D, A01G; for fodder or straw A01F; for bulk butter A01J; for dough A21C; slaughtering A22B; for tobacco, cigars or cigarettes A24; marking-out, perforating or making buttonholes A41H25/00; manufacturing footwear A43D; brushmaking A46D; surgery A61B; disintegrating, mincing or shredding in general B02C; cutting wire, making pins or nails B21F, B21G; of the kind used formetal B23; cutting by abrasive fluid jets B24C5/02; hand-held cutting tools B26B; perforating, cutting-out, stamping-out or punching, or severing by means other than cutting B26F; for wood B27; for stone B28D; working of plastics or substances in a plastic state B29; making boxes, cartons, envelopes or bags, of paper or similarly worked materials, e.g. metal foil, B31B; article or web delivery apparatus incorporating cutting or line-perforating devices B65H35/00; for leather or upholstery B68, C14B; for glass C03B; making matches C06F; for peat C10F; for sugar C13B45/00; for textile materials D06H; civil engineering, building, mining, see Section E; for light guides G02B6/25; cutting processed photographic material G03D15/04) - C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A ceramic green sheet laminate is produced by stacking ceramic green sheets, each including conductive films for forming first or second internal electrodes on a surface thereof. A first cutting step is performed in which the ceramic green sheet laminate is cut to form first and second end surfaces at which the first or second internal electrodes are exposed. A second cutting step is performed in which the ceramic green sheet laminate is cut to form first and second side surfaces at which the first and second internal electrodes are exposed. In the second cutting step, the ceramic green sheet laminate is pressed and cut by moving a cutting blade in a length direction or a width direction. ## Claims ### Claim 1 A method for manufacturing monolithic ceramic electronic components comprising: a step of making ceramic laminates, each including a ceramic laminate main body including first and second principal surfaces extending in a length direction and a width direction, first and second side surfaces extending in the length direction and a thickness direction, and first and second end surfaces extending in the width direction and the thickness direction; first internal electrodes disposed inside the ceramic laminate main body to be parallel or substantially parallel with the first and second principal surfaces, the first internal electrodes being exposed at the first end surface and the first and second side surfaces; and second internal electrodes disposed inside the ceramic laminate main body to face the respective first internal electrodes in the thickness direction, with ceramic layers interposed between adjacent ones of the first and second internal electrodes, the second internal electrodes being exposed at the second end surface and the first and second side surfaces; wherein the step of making ceramic laminates includes: a step of producing a ceramic green sheet laminate by stacking ceramic green sheets in a stacking direction, each including conductive films for forming the first or second internal electrodes on a surface thereof; a first cutting step of cutting the ceramic green sheet laminate by pressing and moving a first cutting blade only in the stacking direction to form the first and second end surfaces at which the first or second internal electrodes are exposed; and a second cutting step of cutting the ceramic green sheet laminate by pressing and moving a second cutting blade only in a direction perpendicular to the stacking direction to form the first and second side surfaces at which the first and second internal electrodes are exposed; wherein in the second cutting step, the ceramic green sheet laminate is pressed and cut by moving the second cutting blade in the length direction or the width direction with a cutting edge of the second cutting blade extending in the stacking direction. ### Claim 2 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the ceramic green sheets are each about 1.5 μm or less in thickness. ### Claim 3 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the second cutting step is performed after the ceramic green sheet laminate is cut into strips and caused to adhere to a base in the first cutting step. ### Claim 4 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the step of making ceramic laminates further includes, before the first and second cutting steps, a step of cutting off an outer edge of the ceramic green sheet laminate to allow the conductive films to be exposed. ### Claim 5 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the ceramic laminate main body has a rectangular or substantially rectangular parallelepiped shape. ### Claim 6 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the monolithic ceramic electronic components are capacitors. ### Claim 7 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the monolithic ceramic electronic components are piezoelectric components. ### Claim 8 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the monolithic ceramic electronic components are thermistors. ### Claim 9 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the monolithic ceramic electronic components are inductors. ### Claim 10 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, further comprising forming protective portions on both sides of the ceramic laminate main body in width directions thereof. ### Claim 11 (depends on 10) The method for manufacturing monolithic ceramic electronic components according to claim 10, wherein the protective portions are areas where the first and second internal electrodes are not present. ### Claim 12 (depends on 10) The method for manufacturing monolithic ceramic electronic components according to claim 10, wherein the protective portions are about 0.2 mm to about 0.5 mm in the width direction. ### Claim 13 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the first and second internal electrodes are made of nickel, copper, silver, palladium, gold, or an alloy containing at least one of nickel, copper, silver, palladium, and gold. ### Claim 14 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, further comprising forming external electrodes on the ceramic laminate main body. ### Claim 15 (depends on 14) The method for manufacturing monolithic ceramic electronic components according to claim 14, wherein the external electrodes each include a foundation layer and a plating layer formed on the foundation layer. ### Claim 16 (depends on 15) The method for manufacturing monolithic ceramic electronic components according to claim 15, wherein the foundation layer includes a sintered metal layer, a plating layer or a conductive resin layer. ### Claim 17 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the ceramic green sheets each include only ceramic portions. ### Claim 18 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the ceramic green sheets each include ceramic portions and conductive portions. ### Claim 19 (depends on 1) The method for manufacturing monolithic ceramic electronic components according to claim 1, wherein the ceramic green sheets each include ceramic portions, conductive portions and a plurality of dot-shaped ceramic portions.