# US 9,039,475 B2 · Manufacturing method of light emitting devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,039,475 B2 - Document ID: US9039475B2 - Status: Granted - Kind: B2 - Application number: 13/527,445 - Filed: 2012-06-19 - Published: 2013-01-03 - Granted: 2015-05-26 - Earliest claimed: 2011-06-30 - Assignees: Toyoda Gosei Co., Ltd. - Applicants: Shigeo Takeda; Makoto Ishida; Mitsushi Terakami; Shota Yamamori - Inventors: Shigeo Takeda; Makoto Ishida; Mitsushi Terakami; Shota Yamamori - Web page: https://patentgrep.com/patent/US9039475B2 ## CPC - H10W 72/0198: {batch processes} - H10W 72/073: {of die-attach connectors} - H10W 72/075: {of bond wires} - H10W 72/07554: {changes in dispositions} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/547: {Dispositions of multiple bond wires} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A manufacturing method of light emitting devices, comprises a substrate-forming step of forming a planar-shaped substrate, a frame-forming step of forming a closed frame on the substrate, an element-mounting step of mounting multiple light emitting elements in an inside of the frame, a sealing step of injecting a liquid material that is to be a sealing member to the inside of the frame so as to seal the multiple light emitting elements, and a dividing step of dividing the multiple light emitting elements together with the substrate and the sealing member so as to obtain multiple light emitting devices with the sealing member exposed from a side surface thereof. ## Claims ### Claim 1 A manufacturing method of light emitting devices, said method comprising: forming a planar-shaped substrate comprising a plurality of insulating members extending in a thickness direction of the substrate; forming a closed frame on the substrate; mounting multiple light emitting elements in an inside of the frame; injecting a liquid material comprising a sealing member to the inside of the frame so as to seal the multiple light emitting elements; and dividing the sealing member in the inside of the frame together with the substrate so as to obtain multiple light emitting devices with the sealing member exposed from a side surface thereof, wherein, in said dividing, one of the plurality of the insulating members, located between the closed frame and one of the multiple light emitting devices adjacent to the closed frame, is cut off from said one of the multiple light emitting devices, and wherein the forming the planar-shaped substrate and the forming the closed frame on the substrate are carried out simultaneously. ### Claim 2 (depends on 1) The manufacturing method of light emitting devices according to claim 1, wherein the substrate includes a resin composite lead frame. ### Claim 3 (depends on 2) The manufacturing method of light emitting devices according to claim 2, wherein the frame gradually tapers larger from a side of the substrate. ### Claim 4 (depends on 2) The manufacturing method of light emitting devices according to claim 2, wherein the frame gradually tapers smaller from a side of the substrate. ### Claim 5 (depends on 2) The manufacturing method of light emitting devices according to claim 2, wherein the frame comprises two wall portions, said two wall portions comprising an inner wall portion and an outer wall portion. ### Claim 6 (depends on 1) The manufacturing method of light emitting devices according to claim 1, wherein the substrate comprises a substrate feed material and the frame. ### Claim 7 (depends on 1) The manufacturing method of light emitting devices according to claim 1, wherein the frame comprises an inner wall portion and an outer wall portion. ### Claim 8 (depends on 7) The manufacturing method of light emitting devices according to claim 7, wherein a height of the inner wall portion is less than a height of the outer wall portion. ### Claim 9 (depends on 7) The manufacturing method of light emitting devices according to claim 7, further comprising forming an annular groove between the inner wall portion and the outer wall portion. ### Claim 10 (depends on 1) The manufacturing method of light emitting devices according to claim 1, wherein the sealing member comprises a silicone base optical transmissive resin. ### Claim 11 (depends on 1) The manufacturing method of light emitting devices according to claim 1, wherein the sealing member comprises an optically transparent acrylic resin. ### Claim 12 (depends on 1) The manufacturing method of light emitting devices according to claim 1, wherein, in said dividing, another one of the plurality of the insulating members is held with each of the multiple light emitting devices, and wherein, in the thickness direction of the substrate, an edge of the closed frame overlaps with an edge of said one of the plurality of the insulating members. ### Claim 13 (depends on 1) The manufacturing method of light emitting devices according to claim 1, further comprising: metal plating a surface of the substrate, the substrate comprising a conductor, wherein another one of the plurality of the insulating members is held with each of the multiple light emitting devices to insulate a first portion of the metal plated surface and the conductor of the substrate from a second portion of the metal plated surface and the conductor of the substrate. ### Claim 14 A method of manufacturing light emitting devices, said method comprising: simultaneously forming a planar-shaped substrate and a frame on said substrate, the substrate comprising a plurality of insulating members extending in a thickness direction of the substrate; mounting a plurality of light emitting elements in an inside of the frame; forming a sealing member in the inside of the frame to seal the plurality of light emitting elements; and dividing both the sealing member and the substrate to form a plurality of light emitting devices, said dividing exposing a side surface of a respective sealing member,. wherein, in said dividing, one of the plurality of the insulating members, located between the frame and one of the multiple light emitting devices adjacent to the frame, is cut off from said one of the multiple light emitting devices. ### Claim 15 (depends on 14) The method according to claim 14, wherein said forming said substrate comprises: forming a base member; forming a plurality of conductor members on the base member; and forming the insulating members configured to insulate the plurality of conductor members from each other, and wherein said forming said frame comprises forming a closed frame. ### Claim 16 (depends on 15) The method according to claim 15, wherein a frame member is bonded to said base member, said frame member having a planar shape identical to a planar shape of the base member. ### Claim 17 (depends on 14) The method according to claim 14, wherein said forming the frame comprises forming an inner wall portion and an outer wall portion. ### Claim 18 (depends on 17) The method according to claim 17, wherein a height of the inner wall portion is less than a height of the outer wall portion. ### Claim 19 (depends on 14) The method according to claim 14, wherein said forming the sealing member comprises injecting a liquid resin into said frame. ### Claim 20 A method of manufacturing light emitting devices, said method comprising: simultaneously forming a substrate and a frame on said substrate; mounting a plurality of light emitting elements in an inside of the frame; forming a sealing member in the inside of the frame to seal the plurality of light emitting elements; and dividing both the sealing member and the substrate to faun a plurality of light emitting devices, said dividing exposing a side surface of a respective sealing member, wherein said forming the frame comprises forming an inner wall portion and an outer wall portion, and wherein a height of the inner wall portion is less than a height of the outer wall portion.