# US 9,039,448 B2 · Electronic interconnect devices having conductive vias > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,039,448 B2 - Document ID: US9039448B2 - Status: Granted - Kind: B2 - Application number: 13/769,584 - Filed: 2013-02-18 - Published: 2014-08-21 - Granted: 2015-05-26 - Earliest claimed: 2013-02-18 - Assignees: Tyco Electronics Corporation - Applicants: Tyco Electronics Corporation - Inventors: Jeffery Walter Mason; Wayne Stewart Alden, III - Web page: https://patentgrep.com/patent/US9039448B2 ## CPC - H01R 13/658: High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] {(coaxial coupling devices specially adapted for high frequency H01R24/40; for flat or ribbon cable connectors H01R12/774; for coaxial cable H01R9/05)} - H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit} - H01R 13/2421: {using coil springs} - H01R 24/38: having concentrically or coaxially arranged contacts - H01R 13/6585: Shielding material individually surrounding or interposed between mutually spaced contacts - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract An electronic interconnect device includes a substrate having a first surface and a second surface. The substrate has a plurality of openings extending between the first and second surfaces. Each opening has a conductive outer via, an insulative barrier and a conductive inner via. The outer via, insulative barrier and inner via are concentric within the opening such that the insulating barrier is disposed between the conductive inner via and the conductive outer via. The conductive inner via is configured to receive a conductor to be inserted therein. ## Claims ### Claim 1 An electronic interconnect device comprising: a substrate having a first surface and a second surface, the substrate having a plurality of openings extending between the first and second surfaces, each opening having a conductive outer via, an insulative barrier deposited on the conductive outer via, and a conductive inner via deposited on the insulative barrier, wherein the conductive outer via, insulative barrier and conductive inner via are concentric within the opening such that the insulating barrier is disposed between the conductive inner via and the conductive outer via; and wherein the conductive inner via defines an open space of the opening configured to receive a conductor to be inserted therein. ### Claim 2 (depends on 1) The electronic interconnect device of claim 1, wherein a plurality of the conductive outer vias are electrically commoned and grounded. ### Claim 3 (depends on 1) The electronic interconnect device of claim 1, further comprising a ground shield on the substrate, the outer vias being electrically common with the ground shield. ### Claim 4 (depends on 1) The electronic interconnect device of claim 1, wherein the substrate is plated with a ground plating on the first surface and in the plurality of openings, the ground plating defining a ground shield on the first surface and defining the conductive outer vias in the openings, each of the outer vias being electrically commoned by the ground shield. ### Claim 5 (depends on 1) The electronic interconnect device of claim 1, wherein the insulative barriers are coated on the corresponding conductive outer vias and the conductive inner vias are plated on the corresponding insulative barriers. ### Claim 6 (depends on 1) The electronic interconnect device of claim 1, further comprising conductors received in the openings and being electrically connected to the conductive inner vias, the conductors transmitting data signals to the conductive inner vias. ### Claim 7 (depends on 1) The electronic interconnect device of claim 1, wherein the conductive outer vias are electrically connected to a ground layer on the first surface, the insulative barriers being integral with an insulative layer deposited on the ground layer. ### Claim 8 (depends on 1) The electronic interconnect device of claim 1, wherein the insulative barriers are integral with an insulative layer deposited on the second surface, the conductive inner vias being electrically connected to solder pads deposited on the insulative layer, solder balls being applied to corresponding signal pads. ### Claim 9 (depends on 1) The electronic interconnect device of claim 1, wherein the substrate further comprises at least one grounding opening therethrough consisting of a conductive ground via electrically connected to the conductive outer vias, each ground opening being devoid of any insulative barrier and any conductive inner via. ### Claim 10 An electronic interconnect device comprising: a substrate having a first surface and a second surface, the substrate having a plurality of openings extending between the first and second surfaces, each opening having a conductive outer via, an insulative barrier deposited on the conductive outer via, and a conductive inner via deposited on the insulative barrier, wherein the conductive outer via, insulative barrier and conductive inner via are concentric within the opening such that the insulative barrier is disposed between the conductive inner via and the conductive outer via, wherein the conductive inner via defines an open space configured to receive a conductor to be inserted therein; and a plurality of conductors received in corresponding conductive inner vias, the conductors being electrically connected to the conductive inner via, the conductors having a first end extending out of the openings and being configured to be electrically connected to a first electronic component. ### Claim 11 (depends on 10) The electronic interconnect device of claim 10, wherein the plurality of conductors are compressive in a longitudinal direction along corresponding opening axes. ### Claim 12 (depends on 10) The electronic interconnect device of claim 10, wherein the plurality of conductors are deflectable in a vertical direction into the openings, the plurality of conductors being deflectable in a horizontal direction to press outward against the inner vias. ### Claim 13 (depends on 10) The electronic interconnect device of claim 10, wherein the plurality of conductors are compressible to shorten and widen the conductors within the openings, the conductors being biased against the conductive inner vias. ### Claim 14 (depends on 10) The electronic interconnect device of claim 10, wherein each conductor comprises a spring and an arrowhead spring extending from the spring and defining the first end, the arrowhead spring having a tip configured to engage the first electronic component, the arrowhead spring being narrower proximate the tip and wider toward the spring. ### Claim 15 (depends on 14) The electronic interconnect device of claim 14, wherein the spring compresses vertically to shorten the conductor, the arrowhead spring deflects outward to widen the conductor and press outward against the conductive inner via. ### Claim 16 (depends on 10) The electronic interconnect device of claim 10 further comprising a cover on the first surface, the cover capturing the conductors in the openings, the conductors being spring biased against toward the cover. ### Claim 17 (depends on 10) The electronic interconnect device of claim 10, wherein the conductors comprise elastomeric columns being internally conductive, the elastomeric column being compressible and pressed outward against the conductive inner vias to define electrical paths between the elastomeric columns and the conductive inner vias. ### Claim 18 (depends on 10) The electronic interconnect device of claim 10, wherein the conductors each have a second end extending out of the openings beyond the second surface, the second ends being configured to be electrically connected to a second electronic component, wherein electrical paths are defined between the first and second electronic components through the conductors and the conductive inner vias. ### Claim 19 (depends on 10) The electronic interconnect device of claim 10, wherein the insulative barriers are integral with an insulative layer deposited on the second surface, the conductive inner vias being electrically connected to signal pads deposited on the insulative layer, solder balls being applied to corresponding signal pads, wherein electrical paths are defined from the first end of the conductor to the conductive inner vias and from the conductive inner vias to the signal pads and solder balls. ### Claim 20 An electronic interconnect system comprising: a substrate having a first surface and a second surface, the substrate having a plurality of openings extending between the first and second surfaces, each opening having a conductive outer via, an insulative barrier deposited on the conductive outer via, and a conductive inner via deposited on the insulative barrier, wherein the conductive outer via, insulative barrier and conductive inner via are concentric within the opening such that the insulative barrier is disposed between the conductive inner via and the conductive outer via, wherein the conductive inner via defines an open space configured to receive a conductor to be inserted therein and electrically connected to the conductive inner via; and an electrical connector having a plurality of conductive compliant pins extending therefrom, the compliant pins comprising the conductors that provide electrical connections with the conductive inner vias, when the electrical connector is mated to the substrate at the first surface such that the compliant pins extend into corresponding openings to engage corresponding conductive inner vias.