# US 9,039,238 B2 · Lighting module and lighting device

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- Number: US 9,039,238 B2
- Document ID: US9039238B2
- Status: Granted
- Kind: B2
- Application number: 13/368,678
- Filed: 2012-02-08
- Published: 2012-06-07
- Granted: 2015-05-26
- Earliest claimed: 2011-02-21
- Assignees: LG Innotek Co., Ltd.
- Applicants: Kwang Soo Kim; Young Ho Shin; Ki Man Park; Bu Kwan Je; Sang Hoon Park; Ye Seul Yang
- Inventors: Kwang Soo Kim; Young Ho Shin; Ki Man Park; Bu Kwan Je; Sang Hoon Park; Ye Seul Yang
- Web page: https://patentgrep.com/patent/US9039238B2

## CPC

- F21V 29/713: {in direct thermal and mechanical contact of each other to form a single system}
- F21K 9/00: Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21S 2/005: {of modular construction}
- F21V 5/007: {Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane (combination of two or more refractors F21V5/008)}
- F21V 5/04: of lens shape
- F21V 5/10: comprising photoluminescent material
- F21V 15/01: Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04})
- F21V 29/507: of means for protecting lighting devices from damage, e.g. housings
- F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V 29/763: {the planes containing the fins or blades having the direction of the light emitting axis}
- F21V 29/85: characterised by the material (liquid coolants F21V29/56)
- F21V 29/87: Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
- F21V 29/89: Metals
- F21V 31/005: {Sealing arrangements therefor}
- F21W 2131/103: of streets or roads
- F21Y 2103/10: comprising a linear array of point-like light-generating elements
- F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements
- F21Y 2115/10: Light-emitting diodes [LED]
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21W: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

A lighting module may be provided that includes: a light emitter; a clad metal substrate which is disposed under the light emitter; an insulating structure which insulates the light emitter from the clad metal substrate; an optical structure which is disposed on the light emitter; and a case which is disposed on the optical structure and is coupled to the clad metal substrate, wherein the light emitter includes a semiconductor based light emitting device.

## Claims

### Claim 1

A lighting module comprising:
a light emitter comprising a substrate and a light emitting device disposed on the substrate;
a clad metal substrate disposed under the substrate of the light emitter, the clad metal substrate being planar;
an insulating structure disposed on the clad metal substrate;
an optical structure disposed on the light emitter, the optical structure comprising an outer frame surrounding the substrate and a plurality of lenses corresponding to the plurality of the light emitting devices;
a case disposed on the optical structure and coupled to the clad metal substrate; and
a packing structure disposed between the optical structure and the case,
wherein the insulating structure surrounds the outer frame of the optical structure and insulates the light emitter from the case,
wherein the clad metal substrate comprises:
a first metal layer; and
a second metal layer disposed on the first metal layer,
wherein a thermal conductivity of the second metal layer is greater than a thermal conductivity of the first metal layer, and
wherein a diameter of the case is greater than a diameter of the insulating structure.

### Claim 2 (depends on 1)

The lighting module of claim 1, wherein the insulating structure surrounds an outer circumferential surface of the substrate and insulates the outer circumferential surface of the substrate from the clad metal substrate.

### Claim 3 (depends on 1)

The lighting module of claim 1,
wherein the plurality of lenses correspond to the plurality of the light emitting devices one-to-one, and
wherein the packing structure is disposed on the outer frame, and
wherein the outer frame is disposed on the substrate and causes the lens and the light emitting device to be spaced from each other.

### Claim 4 (depends on 1)

The lighting module of claim 1, further comprising a heat radiating plate disposed between the light emitter and the clad metal substrate.

### Claim 5

A lighting device comprising:
a heat sink which includes a receiving recess and a plurality of partitions disposed on a portion thereof;
one or more lighting modules which are disposed under the heat sink and emit light downward;
a power supplier which is disposed in the receiving recess and supplies electric power to the lighting module; and
a waterproof cap which is coupled to at least a portion of the top surface of the heat sink and prevents water from being introduced into the receiving recess of the heat sink,
wherein the lighting module includes:
a light emitter including a substrate and a plurality of light emitting diodes disposed on the substrate;
a clad metal substrate disposed under the substrate of the light emitter;
an insulating structure disposed on the clad metal substrate;
an optical structure disposed on the light emitter, the optical structure comprising an outer frame surrounding the substrate and a plurality of lenses corresponding to the plurality of the light emitting devices;
a case disposed on the light emitter and coupled to the clad metal substrate; and
a packing structure disposed between the optical structure and the case,
wherein the insulating structure surrounds the outer frame of the optical structure and insulates the light emitter from the case by contacting the case,
wherein the clad metal substrate comprises a first metal layer and a second metal layer disposed on the first metal layer,
wherein a thermal conductivity of the second metal layer of the clad metal substrate is greater than a thermal conductivity of the first metal layer, and
wherein a diameter of the case is greater than a diameter of the insulating structure.

### Claim 6 (depends on 5)

The lighting device of claim 5, further comprising a programmable logic controller (PLC) module which is disposed in the receiving recess of the heat sink and controls the operation of the lighting module.

### Claim 7 (depends on 5)

The lighting device of claim 5, further comprising a main cover which is disposed on the top surface of the heat sink.

### Claim 8 (depends on 5)

The lighting device of claim 5, further comprising:
a fastener which is coupled to one of both sides of the heat sink; and
a connector which is coupled to the other of both sides of the heat sink.

### Claim 9 (depends on 8)

The lighting device of claim 8, wherein the connector comprises:
a body support which receives a component supporting the lighting module; and
an upper cover which is disposed on the body support.

### Claim 10 (depends on 5)

The lighting device of claim 5, wherein the waterproof cap is coupled near both edges of a position corresponding to the receiving recess.

### Claim 11 (depends on 10)

The lighting device of claim 10, wherein a lower portion of the waterproof cap comprises a recess which is coupled to the partition, wherein an inner wall of the recess comprises a coupling recess, and wherein the partition comprises a coupling projection which is coupled correspondingly to the coupling recess.

### Claim 12 (depends on 5)

The lighting device of claim 5, wherein the clad metal substrate is planar.

### Claim 13

A lighting module comprising:
a support layer;
a light emitter which includes a substrate disposed on the support layer and a plurality of light emitting devices disposed on the substrate;
an optical structure covering the light emitter;
a packing structure disposed on the optical structure;
an insulating structure disposed on the support layer and surrounding the optical structure; and
a case receiving the light emitter, the optical structure, the packing structure and the insulating structure, and coupled to the support layer,
wherein the insulating structure seals a space between the optical structure and the case,
wherein the light emitting devices include a light emitting diode (LED),
wherein the case comprises a side wall and an edge part,
wherein the side wall surrounds the optical structure, the packing structure and the insulating structure,
wherein the edge part extends from the side wall, is disposed on the packing structure and defines an opening,
wherein the packing structure comprises a top surface contacting the edge part of the case and a bottom surface contacting the optical structure,
wherein each of the top surface of the packing structure and the bottom surface of the packing structure has a recess, and
wherein a projection from the case engages the recess on the top surface of the packing structure and a projection from the optical structure engages the recess on the bottom surface of the packing structure.

### Claim 14 (depends on 13)

The lighting module of claim 13, wherein the support layer has electrically insulation characteristics and thermally a heat radiating characteristic.

### Claim 15 (depends on 14)

The lighting module of claim 14, wherein the support layer comprises a polymeric material or a non-metallic material.

### Claim 16 (depends on 13)

The lighting device module of claim 13,
wherein the edge part comprises a projection part inserted into the receiving recess.

### Claim 17 (depends on 13)

The lighting device module of claim 13,
wherein the optical structure comprises a projection part inserted into the receiving recess.

### Claim 18 (depends on 13)

The lighting module of claim 13, wherein the side wall of the case comprises a projection part extending from a bottom surface of the side wall, and
wherein the projection part surrounds a side surface of the support layer.

### Claim 19 (depends on 13)

The lighting module of claim 13, wherein the insulating structure comprises a stepped surface, and
wherein the side wall of the case comprises a stepped surface contacted with the stepped surface of the insulating structure.

### Claim 20 (depends on 13)

The lighting module of claim 13, wherein the side wall of the case comprises a plurality of heat radiating fins.

### Claim 21 (depends on 13)

The lighting module of claim 13, wherein the support layer is planar.

### Claim 22 (depends on 13)

The lighting module of claim 13, wherein the insulating structure contacts an outer peripheral surface of the support layer.

### Claim 23 (depends on 13)

The lighting module of claim 13, wherein the optical structure comprises an outer frame surrounding the substrate and a plurality of lenses corresponding one-to-one to the plurality of the light emitting devices.

### Claim 24 (depends on 13)

The lighting module of claim 13, wherein the insulating structure comprises a bottom surface contacting the support layer, and
wherein the bottom surface of the insulating structure has a recess.