# US 9,039,216 B2 · Light emitting device package and light unit having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,039,216 B2 - Document ID: US9039216B2 - Status: Granted - Kind: B2 - Application number: 13/075,354 - Filed: 2011-03-30 - Published: 2011-09-01 - Granted: 2015-05-26 - Earliest claimed: 2010-04-01 - Assignees: LG Innotek Co., Ltd. - Applicants: Wan Ho Kim - Inventors: Wan Ho Kim - Web page: https://patentgrep.com/patent/US9039216B2 ## CPC - H10H 20/853: characterised by their shape - H10H 20/8515: {not being in contact with the bodies} - G02F 1/133603: {with LEDs} - H10H 20/8506: {Containers} - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/858: Means for heat extraction or cooling - H10H 20/8581: {characterised by their material} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed are a light emitting device package and a light unit having the same. The light emitting device package includes a ceramic substrate; a light emitting device on the ceramic substrate; a first light-transmissive resin layer on the ceramic substrate to cover the light emitting device; and a phosphor layer on the first light-transmissive resin layer. ## Claims ### Claim 1 A light emitting device package comprising: a ceramic substrate; a semiconductor light emitting device disposed on a top surface of the ceramic substrate; a first light-transmissive resin layer disposed on the top surface of the ceramic substrate and a top surface of the semiconductor light emitting device to cover the semiconductor light emitting device; a second light-transmissive resin layer disposed on a top surface of the first light-transmissive resin layer; and a phosphor layer including a phosphor material between the top surface of the first light-transmissive resin layer and a lower surface of the second light-transmissive resin layer, wherein the first light-transmissive resin layer has a same width as a width of the ceramic substrate, wherein the first and second light-transmissive resin layers include a convex portion protruding upward of the semiconductor light emitting device, wherein the first light-transmissive resin layer physically contacts a surface of the semiconductor light emitting device, wherein the lower surface of the second light-transmissive resin layer physically contacts a top surface of the phosphor layer, wherein the first light-transmissive resin layer includes a planar top surface substantially parallel to the top surface of the ceramic substrate on a periphery of the convex portion of the first light-transmissive resin layer, wherein the second light-transmissive resin layer includes a planar top surface substantially parallel to the top surface of the ceramic substrate on a periphery of the convex portion of the second light-transmissive resin layer, wherein a lower surface of the phosphor layer is spaced apart from the top surface of the ceramic substrate, and wherein the first and second light-transmissive resin layers do not contain any phosphor material. ### Claim 2 (depends on 1) The light emitting device package of claim 1, further comprising: first and second electrode patterns electrically connected to the semiconductor light emitting device and disposed on the ceramic substrate; third and fourth electrode patterns under the ceramic substrate; and a plurality of first and second conductive vias to connect the first and second electrode patterns with the third and fourth electrode patterns according to polarity of the first to fourth electrode patterns. ### Claim 3 (depends on 2) The light emitting device package of claim 2, further comprising: a heat radiation pattern disposed under a lower surface of the ceramic substrate and physically contacting the lower surface of the ceramic substrate; and a third conductive via physically contacting the heat radiation pattern and the first electrode pattern. ### Claim 4 (depends on 3) The light emitting device package of claim 3, wherein the semiconductor light emitting device is disposed on the first electrode pattern and physically contacts the heat radiation pattern. ### Claim 5 (depends on 2) The light emitting device package of claim 2, further comprising: a first heat radiation pattern on the substrate and spaced apart from the first and second electrode patterns; a second heat radiation pattern under a lower surface of the substrate; and a fourth conductive via physically contacting the first and second heat radiation patterns, wherein the semiconductor light emitting device is disposed on the first heat radiation pattern. ### Claim 6 (depends on 1) The light emitting device package of claim 1, wherein the planar top surface of the first light-transmissive resin layer overlaps the lower surface of the phosphor layer in a vertical direction. ### Claim 7 A light emitting device package comprising: a substrate; a semiconductor light emitting device on the substrate; a plurality of resin layers disposed on a top surface of the substrate and the semiconductor light emitting device; and a moisture barrier layer physically contacting a vertical sidewall of the substrate and a sidewall of the plurality of resin layers, wherein the plurality of resin layers overlaps the semiconductor light emitting device, wherein the moisture barrier layer is directly disposed on a boundary between the sidewall of the substrate and at least one of the plurality of resin layers adjacent to the substrate, and wherein a portion of the moisture barrier layer is located at a lower position than the top surface of the substrate and does not overlap the substrate in a vertical direction. ### Claim 8 (depends on 7) The light emitting device package of claim 7, wherein the moisture barrier layer is formed of a same material as a material of the plurality of resin layers or the substrate. ### Claim 9 (depends on 7) The light emitting device package of claim 7, wherein the plurality of resin layers has a width equal to or less than a width of the substrate and sidewalls of the substrate are disposed at an outer portion than that of the plurality of resin layers, and wherein the moisture barrier layer physically contacts the top surface of the substrate. ### Claim 10 (depends on 7) The light emitting device package of claim 7, further comprising: first and second electrode patterns electrically connected to the semiconductor light emitting device and disposed on the substrate; third and fourth electrode patterns under the substrate; and a plurality of first and second conductive vias to connect the first and second electrode patterns with the third and fourth electrode patterns according to polarity of the first to fourth electrode patterns; a heat radiation pattern under a lower surface of the substrate; and a third conductive via physically contacting the heat radiation pattern and the first electrode pattern. ### Claim 11 (depends on 10) The light emitting device package of claim 10, wherein the substrate is a ceramic substrate and the semiconductor light emitting device is formed on the first electrode pattern physically contacting the heat radiation pattern. ### Claim 12 (depends on 11) The light emitting device package of claim 11, wherein the substrate has a planar top surface, and wherein at least one of the plurality of resin layers includes a planar top surface on a periphery region adjacent the sidewall of the substrate. ### Claim 13 (depends on 7) The light emitting device package of claim 7, wherein the moisture barrier layer is disposed on a whole sidewall of one of the plurality of resin layers. ### Claim 14 (depends on 7) The light emitting device package of claim 7, wherein the moisture barrier layer includes at least one of alumina, aluminum nitride, silicon, epoxy and hybrid resin. ### Claim 15 (depends on 7) The light emitting device package of claim 7, wherein the plurality of resin layers includes: a first light-transmissive layer disposed on the top surface of the substrate; a phosphor layer disposed on a top surface the first light-transmissive resin layer; and a second light-transmissive resin layer having a lens unit disposed on a top surface of the phosphor layer, and wherein the phosphor layer physically contacts the first light-transmissive resin layer and the second light-transmissive resin layer. ### Claim 16 (depends on 15) The light emitting device package of claim 15, wherein the first light-transmissive resin layer, the phosphor layer, and the second light-transmissive resin layer each have a width equal to or larger than a width of the substrate. ### Claim 17 (depends on 15) The light emitting device package of claim 15, wherein the first and second light-transmissive resin layers include a convex portion protruding upward of the semiconductor light emitting device, and wherein the first light-transmissive resin layer includes a planar top surface substantially parallel to the top surface of the ceramic substrate on a periphery of the convex portion. ### Claim 18 (depends on 15) The light emitting device package of claim 15, wherein the first and second light-transmissive resin layers do not contain any phosphor material. ### Claim 19 (depends on 18) The light emitting device package of claim 18, wherein the phosphor layer is spaced apart from the top surface of the substrate. ### Claim 20 (depends on 7) The light emitting device package of claim 7, wherein the moisture barrier layer directly contacts a boundary between lateral surfaces of the plurality of resin layers.