# US 9,038,998 B2 · Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,038,998 B2 - Document ID: US9038998B2 - Status: Granted - Kind: B2 - Application number: 13/510,151 - Filed: 2010-11-16 - Published: 2012-11-01 - Granted: 2015-05-26 - Earliest claimed: 2009-11-17 - Assignees: Orthodyne Electronics Corporation - Applicants: Jonathan Michael Byars - Inventors: Jonathan Michael Byars - Web page: https://patentgrep.com/patent/US9038998B2 ## CPC - H10W 72/0198: {batch processes} - H10W 72/076: {of strap connectors} - H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices - H10W 72/0711: {Apparatus therefor} - H10W 72/07178: {Means for aligning} - H10W 72/07532: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/07653: {changes in shapes} - H10W 72/534: {being rectangular} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5438: {the bond wires having multiple connections on the same bond pad} - H10W 72/5453: {connecting between multiple bond pads on a chip, e.g. daisy chain} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - Y10S 269/903: Work holder for electrical circuit assemblages or wiring systems - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation. ## Claims ### Claim 1 A support structure for supporting a semiconductor device during a bonding operation, the support structure comprising: a body portion, the body portion defining an upper surface configured to support a semiconductor device during a bonding operation, the upper surface defining a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation, wherein the constraining feature includes a raised portion raised above the upper surface to constrain the portion of the semiconductor device during the bonding operation. ### Claim 2 (depends on 1) The support structure of claim 1 further comprising a base portion wherein the body portion is secured to the base portion during the bonding operation. ### Claim 3 (depends on 2) The support structure of claim 2 wherein the base portion is formed from a first material and the body portion is formed from a second material, the second material being different from the first material. ### Claim 4 (depends on 3) The support structure of claim 3 wherein the base portion is formed from a metallic material and the body portion is formed from an insulative material. ### Claim 5 (depends on 3) The support structure of claim 3 wherein the body portion is formed from a ceramic material. ### Claim 6 (depends on 3) The support structure of claim 3 further comprising a compliant material between the body portion and the base portion. ### Claim 7 (depends on 2) The support structure of claim 2 further comprising a compliant material between the body portion and the base portion. ### Claim 8 (depends on 1) The support structure of claim 1 wherein support structure is an anvil configured for use on a wedge bonding machine. ### Claim 9 (depends on 1) The support structure of claim 1 wherein the raised portion includes substantially parallel raised features to constrain the portion of the semiconductor device during the bonding operation. ### Claim 10 (depends on 1) The support structure of claim 1 wherein the raised portion defines a valley to constrain the portion of the semiconductor device during the bonding operation. ### Claim 11 (depends on 1) The support structure of claim 1 wherein the raised portion includes a plurality of wall portions to at least partially surround, and thereby constrain, the portion of the semiconductor device during the bonding operation. ### Claim 12 (depends on 1) The support structure of claim 1 wherein the semiconductor device includes a leadframe, and wherein the portion of the semiconductor device constrained by the raised feature includes a portion of the leadframe. ### Claim 13 (depends on 12) The support structure of claim 12 wherein the portion of the leadframe constrained by the raised feature includes at least one of a lead, a tie bar, a heat sink, and a die paddle of the leadframe. ### Claim 14 (depends on 1) The support structure of claim 1 wherein the semiconductor device includes a leadframe, and wherein the portion of the semiconductor device constrained during the bonding operation by the constraining feature includes a portion of the leadframe. ### Claim 15 (depends on 14) The support structure of claim 14 wherein the portion of the leadframe constrained by the constraining feature includes at least one of a lead and a tie bar of the leadframe. ### Claim 16 (depends on 1) The support structure of claim 1 wherein the constraining feature is configured to constrain the portion of the semiconductor device in at least one direction. ### Claim 17 (depends on 16) The support structure of claim 16 wherein the at least one direction is a horizontal direction. ### Claim 18 (depends on 16) The support structure of claim 16 wherein the at least one direction includes a direction of ultrasonic scrubbing of a bonding tool motion of a wire bonding machine. ### Claim 19 (depends on 16) The support structure of claim 16 wherein the at least one direction includes at least two directions.