# US 9,038,913 B2 · Electronic interface apparatus and method and system for manufacturing same

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- Number: US 9,038,913 B2
- Document ID: US9038913B2
- Status: Granted
- Kind: B2
- Application number: 12/596,893
- Filed: 2007-11-08
- Published: 2010-08-12
- Granted: 2015-05-26
- Earliest claimed: 2007-04-24
- Assignees: Smartrac IP B.V.
- Applicants: Guy Shafran; Oded Bashan
- Inventors: Guy Shafran; Oded Bashan
- Web page: https://patentgrep.com/patent/US9038913B2

## CPC

- G06K 19/07754: {the connection being galvanic}
- G06K 19/07745: {Mounting details of integrated circuit chips}
- G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card}
- G06K 19/0775: {arrangements for connecting the integrated circuit to the antenna}
- G06K 19/07773: {Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22)}
- Y10T 29/49002: Electrical device making
- Y10T 29/49016: Antenna or wave energy "plumbing" making
- Y10T 29/49018: with other electrical component
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49169: Assembling electrical component directly to terminal or elongated conductor
- Y10T 29/5317: Laminated device
- Y10T 29/53178: Chip component
- G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for manufacture of an electronic interface card (100) including defining a pair of apertures in a substrate layer (116), associating an antenna (112) with the substrate layer (116) such that opposite ends of the antenna (112) terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer (114) and a bottom layer (118), forming a recess (122) in the top layer and the substrate layer, attaching end of connection wires (130) to the metal elements, attaching opposite ends of the connection wires (130) to a chip module (120) and sealing the chip module in the recess (122).

## Claims

### Claim 1

A method for manufacture of a chip card having an electronic interface, comprising:
defining a pair of apertures in a substrate layer;
associating an antenna with said substrate layer such that opposite ends of said antenna terminate at said apertures, wherein said associating is performed after said defining;
placing a metal element in each of said apertures, wherein said placing is performed after said associating;
connecting said ends of said antenna to said metal elements, wherein said connecting is performed after said placing;
laminating said substrate layer together with a top layer and a bottom layer, wherein said laminating is performed after said connecting;
forming a recess in said top layer and said substrate layer to expose the metal elements in the recess formed, wherein said forming is performed after said laminating;
attaching ends of connection wires to said metal elements exposed in the recess;
attaching opposite ends of said connection wires to a chip module; and
inserting the chip module into said recess and sealing said chip module in said recess, wherein the steps of attaching said ends and said opposite ends of said connection wires to said metal elements and said chip module, respectively, are carried out while said chip module is positioned completely outside of said recess, and wherein each of said connection wires is a single integral piece and has sufficient length to extend outside of said recess after said ends of said connection wires are attached to said metal elements and said opposite ends of said connection wires are attached to said chip module.

### Claim 2 (depends on 1)

A method according to claim 1 and also comprising providing a first additional substrate layer and a second additional substrate layer onto the underside of said substrate layer prior to said laminating.

### Claim 3 (depends on 1)

A method according to claim 1 and wherein said top layer comprises a first top substrate layer and a second top substrate layer.

### Claim 4 (depends on 3)

A method according to claim 3 and also comprising exposing a recessed surface of said second top layer adjacent said recess and wherein said sealing comprises:
placing an adhesive on an underside of said chip module; and
inserting said chip module into said recess such that said underside engages said recessed surface.

### Claim 5 (depends on 1)

A method according to claim 1 and also comprising folding said wires underneath said chip module.

### Claim 6 (depends on 1)

A method according to claim 1 and wherein said method is automated.

### Claim 7 (depends on 1)

A method according to claim 1 and wherein said attaching ends of connection wires to said metal elements comprises laser bonding.

### Claim 8 (depends on 1)

A method according to claim 1 and wherein said attaching opposite ends of said connection wires to a chip module comprises soldering.

### Claim 9 (depends on 1)

A method for manufacture of an electronic interface card according to claim 1 and wherein said wires have a length substantially greater than the distance between their respective opposite ends in said electronic interface card.