# US 9,038,534 B2 · Embossing media

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- Number: US 9,038,534 B2
- Document ID: US9038534B2
- Status: Granted
- Kind: B2
- Application number: 13/715,379
- Filed: 2012-12-14
- Published: 2014-06-19
- Granted: 2015-05-26
- Earliest claimed: 2012-12-14
- Assignees: Hewlett-Packard Indigo B.V.
- Applicants: Hewlett-Packard Indigo B.V.
- Inventors: Ziv Gilan; Gadi Oron; Elkan Jhirad; Eyal Shelef
- Web page: https://patentgrep.com/patent/US9038534B2

## CPC

- B44B 5/0095: {using computer control means}
- B44B 5/0004: {characterised by the movement of the embossing tool(s), or the movement of the work, during the embossing operation}
- B44B 5/0052: {by pressing (B44B5/0061 and B44B5/0076 take precedence)}
- B44B: MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING (processes for producing decorative effects B44C; embossing leather C14B)

## Abstract

Apparatus for embossing media, the apparatus including cutter apparatus to cut a shape in a surface layer of a multi-layer substrate to form a die. The apparatus also includes an embosser to emboss the media using the die. The cutter apparatus is arranged to provide the die to the embosser.

## Claims

### Claim 1

An apparatus for embossing media, the apparatus comprising:
a cutter apparatus to cut a shape in a surface layer of a multi-layer substrate to form a die;
an embosser to emboss the media using the die, the cutter apparatus being arranged to provide the die to the embosser;
a second collector to remove the die from the embosser after the die has been used by the embosser to emboss the media; and
a controller to control the second collector to remove the die from the embosser using data defining another shape to be cut.

### Claim 2 (depends on 1)

The apparatus as claimed in claim 1, wherein the cutter apparatus comprises a laser.

### Claim 3 (depends on 2)

The apparatus as claimed in claim 2, wherein the laser is arranged to operate in a plurality of different modes to achieve different forms of die.

### Claim 4 (depends on 1)

The apparatus as claimed in claim 1, further comprising a first collector to remove a portion of the surface layer of the multi-layer substrate after the multi-layer substrate has been cut by the cutter apparatus and prior to the embosser embossing the media using the die.

### Claim 5 (depends on 1)

The apparatus as claimed in claim 1, further comprising a dispenser to store a web of the multi-layer substrate.

### Claim 6 (depends on 1)

The apparatus as claimed in claim 1, wherein the embosser is arranged to repeatedly use the die to emboss media.

### Claim 7 (depends on 1)

The apparatus as claimed in claim 1, wherein the apparatus is a unitary device and further comprises a housing to house the cutter apparatus and the embosser.

### Claim 8 (depends on 1)

The apparatus as claimed in claim 1, wherein the apparatus is part of a printing system.

### Claim 9

A method of controlling an apparatus for embossing media, the method comprising:
controlling a die former to selectively remove a portion of a surface layer of a multi-layer substrate to form a die; and
controlling a pressure applicator to emboss the media using the die, the die former being arranged to provide the die to the pressure applicator; and
controlling a second collector to remove the die from the embosser after the die has been used b the embosser to emboss the media is performed using data defining another shape to be cut.

### Claim 10 (depends on 9)

The method as claimed in claim 9, further comprising receiving data defining a shape to be cut in the multi-layer substrate, and wherein controlling the die former is performed using the received data.

### Claim 11 (depends on 9)

The method as claimed in claim 9, wherein controlling the die former comprises controlling a first collector to remove a portion of the surface layer of the multi-layer substrate after the multi-layer substrate has been cut by the die former and prior to the embosser embossing the media using the die.

### Claim 12 (depends on 9)

The method as claimed in claim 9, further comprising controlling the removal of the multi-layer substrate from a dispenser.

### Claim 13 (depends on 12)

The method as claimed in claim 12, wherein the die former comprises a laser arranged to operate in a plurality of different modes to achieve different forms of die, the method further comprising controlling the mode of the laser.

### Claim 14 (depends on 12)

The method as claimed in claim 12, further comprising controlling the pressure applicator to repeatedly use the die to emboss media.