# US 9,038,463 B2 · Electronic device, manufacturing method thereof, and electronic apparatus

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- Number: US 9,038,463 B2
- Document ID: US9038463B2
- Status: Granted
- Kind: B2
- Application number: 13/608,114
- Filed: 2012-09-10
- Published: 2013-03-28
- Granted: 2015-05-26
- Earliest claimed: 2011-09-22
- Assignees: Seiko Epson Corporation
- Applicants: Teruo Takizawa
- Inventors: Teruo Takizawa
- Web page: https://patentgrep.com/patent/US9038463B2

## CPC

- G01C 19/5712: the devices involving a micromechanical structure
- B81B 7/0041: {maintaining a controlled atmosphere with techniques not provided for in B81B7/0038}
- G01C 25/00: Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass (testing, calibrating or compensating compasses G01C17/38)
- B81B 2201/0242: Gyroscopes
- B81C 2203/0145: Hermetically sealing an opening in the lid
- Y10T 29/4989: with spreading of cable strands
- Y10T 29/4998: Combined manufacture including applying or shaping of fluent material
- G01C: MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY (measuring liquid level G01F; radio navigation, determining distance or velocity by use of propagation effects, e.g. Doppler effects, propagation time, of radio waves, analogous arrangements using other waves G01S)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An electronic device includes a base body, a functional element that is placed on the base body, and a lid body, formed from silicon, that is placed over the base body so as to cover the functional element. A hole portion and a sealing member that closes the hole portion are disposed in the lid body, in the hole portion, the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side, and the ratio of the volume of the sealing member to the volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%.

## Claims

### Claim 1

An electronic device comprising:
a base body;
a functional element that is placed on the base body;
a lid body, formed from silicon, that is placed over the base body so as to cover the functional element; and
a cavity that houses the functional element, wherein the cavity is surrounded by the base body and the lid body,
wherein a hole portion and a sealing member that closes the hole portion are disposed in the lid body,
wherein, in the hole portion, the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side, and
wherein a ratio of a volume of the sealing member to a volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%,
wherein the hole portion includes a bottom face and communicates with the cavity through a communication hole that is disposed in a part of the bottom face, and
wherein, when an opening area of the second opening of the hole portion is S1, an opening area of the first opening of the communication hole is S2, an opening area of the communication hole on the cavity side is S3, and the area of the bottom face of the hole portion is S4, relation of “S2<S3<S4<S1” is satisfied; wherein the bottom face of the hole portion is flat.

### Claim 2 (depends on 1)

The electronic device according to claim 1,
wherein the ratio of the volume of the sealing member to the volume of the hole portion is equal to or higher than 35% and is equal to or lower than 58%.

### Claim 3 (depends on 1)

The electronic device according to claim 1,
wherein a shape of the first opening is a polygon.

### Claim 4 (depends on 3)

The electronic device according to claim 3,
wherein a corner portion of the second opening is not filled with the sealing member.

### Claim 5 (depends on 1)

The electronic device according to claim 1,
wherein the functional element is arranged at a position not overlapping the first opening in a plan view.

### Claim 6 (depends on 1)

The electronic device according to claim 1,
wherein a metal layer is disposed on a side face of the hole portion, and
wherein a material of the sealing member is an alloy that contains an element included in the metal layer.

### Claim 7 (depends on 1)

The electronic device according to claim 1,
wherein the base body is formed from glass, and
wherein the functional element is a gyro sensor using silicon.

### Claim 8 (depends on 1)

The electronic device according to Claim 1,
wherein a shape of the second opening of the hole portion, the first opening of the communication hole, and an opening of the communication hole on the cavity side is a polygon.

### Claim 9 (depends on 1)

The electronic device according to Claim 1,
wherein the functional element is arranged so as not to overlap the opening of the communication hole on the cavity side in a plan view.

### Claim 10 (depends on 1)

The electronic device according to claim 1,
wherein the lid body is placed in the base body and includes the hole portion disposed on one face side and a cavity disposed on the other face side,
wherein the functional element is housed in the cavity, and
wherein the hole portion includes a bottom face, includes the second opening that has a polygonal shape in a plan view, and communicates with the cavity through the first opening that is disposed in a part of the bottom face of the hole portion.

### Claim 11 (depends on 10)

The electronic device according to claim 10,
wherein the bottom face of the hole portion is flat.

### Claim 12 (depends on 10)

The electronic device according to claim 10,
wherein the area of the first opening is smaller than the area of the second opening.

### Claim 13 (depends on 10)

The electronic device according to claim 10,
wherein the first opening does not overlap the functional element in a plan view.

### Claim 14

A method of manufacturing an electronic device, the method comprising:
placing a functional element on a base body;
forming a hole portion in a lid body that is formed from silicon;
housing the functional element by placing the lid body on the base body;
arranging a sealing member in the hole portion; and
closing the hole portion by melting the sealing member with energy beams,
wherein, the hole portion is formed such that the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side,
wherein a ratio of a volume of the sealing member to a volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%,
wherein a cavity houses the functional element, wherein the cavity is surrounded by the base body and the lid body, wherein the hole portion is a flat bottom face and communicates with the cavity through a communication hole that is disposed in a part of the flat bottom face; and
wherein, when an opening area of the second opening of the hole portion is S1, an opening area of the first opening of the communication hole is S2, an opening area of the communication hole on the cavity side is S3, and the area of the flat bottom face of the hole portion is S4, relation of “S2 <S3 <S4 <S1” is satisfied.

### Claim 15 (depends on 14)

The method according to claim 14,
wherein, in the closing of the hole portion, the sealing member is melt after an atmosphere of the functional element side is decompressed through the hole portion.

### Claim 16 (depends on 1)

An electronic apparatus comprising an electronic device according to claim 1.