# US 9,038,407 B2 · Electro-hydrodynamic cooling with enhanced heat transfer surfaces

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- Number: US 9,038,407 B2
- Document ID: US9038407B2
- Status: Granted
- Kind: B2
- Application number: 13/644,105
- Filed: 2012-10-03
- Published: 2014-04-03
- Granted: 2015-05-26
- Earliest claimed: 2012-10-03
- Assignees: Hamilton Sundstrand Corporation
- Applicants: Hamilton Sundstrand Corporation
- Inventors: Matthew Robert Pearson; Mohsen Farzad
- Web page: https://patentgrep.com/patent/US9038407B2

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The electronic control has an electric control which incorporates circuitry which will generate heat in use. A cooling channel placed in contact with at least one surface on the electric control. The cooling channel has a portion which receives an enhanced heat transfer surface. At least one electrode pair is mounted on an inlet channel portion upstream of the portion of the channel that receives the enhanced heat transfer surface. A source of current is provided for the electrode. The electrode induces an electric field in the inlet channel, to drive a dielectric fluid across the enhanced heat transfer surfaces.

## Claims

### Claim 1

An electronic element and cooling system comprising:
an electric element which will generate heat in use;
a cooling channel placed in contact with at least one surface on said electric element, and said cooling channel having a portion receiving an enhanced heat transfer surface;
at least one electrode pair mounted on an inlet channel upstream of said portion of said cooling channel receiving said enhanced heat transfer surface, and a source of current for said electrode, said electrode for inducing an electric field in said inlet channel to drive a fluid across said enhanced heat transfer surfaces due to electrohydrodynamic conduction pumping; and
wherein a height of said enhanced heat transfer surfaces is defined in a direction measured away from said at least one surface of said electric element and a ratio of said height of said enhanced heat transfer surfaces to a height of said portion of said cooling channel receiving said enhanced heat transfer surfaces is between 0.1 and 1.

### Claim 2

An electronic element and cooling system comprising:
an electric element which will generate heat in use;
a plurality of cooling channels placed in contact with surfaces on said electric element, and said cooling channels each having a portion receiving an enhanced heat transfer surface;
an electrode mounted on an inlet channel upstream of said portion of each said cooling channel receiving said enhanced heat transfer surface, and a source of current for said electrodes, said electrodes for inducing an electric field in said inlet channels to drive a dielectric fluid across said enhanced heat transfer surfaces;
said cooling mounted on opposed sides of said electric element;
said cooling channels communicate with an outlet plenum, and said outlet plenum communicating with an inlet plenum, said inlet plenum communicating with said inlet channels;
a heat exchanger mounted on a return line which communicates said outlet plenum back to said inlet plenum; and
said enhanced transfer heat surfaces include nanofibers with a height of said fibers defined in a direction measured away from said surfaces of said electric control, and a ratio of said height of said nanofibers to a height of each said portion of said cooling channels receiving said enhanced heat transfer surfaces is between 0.1 and 1 and an average diameter of said nanofibers being between 10 to 1000 nanometers.

### Claim 3 (depends on 2)

The electronic element as set forth in claim 2, wherein said nanofibers are part of a nanomat.

### Claim 4 (depends on 2)

The electronic element as set forth in claim 2, wherein said nanofibers are formed of a plastic or metal.

### Claim 5 (depends on 4)

The electronic element as set forth in claim 4, wherein said nanofibers are formed of copper.