# US 9,038,266 B2 · Multilayer printed wiring board and method for manufacturing multilayer printed wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,038,266 B2 - Document ID: US9038266B2 - Status: Granted - Kind: B2 - Application number: 13/314,689 - Filed: 2011-12-08 - Published: 2012-04-05 - Granted: 2015-05-26 - Earliest claimed: 2008-09-30 - Assignees: Ibiden Co., Ltd. - Applicants: Sho Akai; Tatsuya Imai; Iku Tokihisa - Inventors: Sho Akai; Tatsuya Imai; Iku Tokihisa - Web page: https://patentgrep.com/patent/US9038266B2 ## CPC - H05K 3/389: {by the use of a coupling agent, e.g. silane} - H05K 3/384: {by plating} - H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)} - H05K 3/421: {Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence)} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 2203/0361: Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser - H05K 2203/073: Displacement plating, substitution plating or immersion plating, e.g. for finish plating - H05K 2203/0789: Aqueous acid solution, e.g. for cleaning or etching - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer. ## Claims ### Claim 1 A method for manufacturing a multilayer printed wiring board, comprising: forming a first interlayer resin insulation layer; forming a first conductive circuit on the first interlayer resin insulation layer; forming on the first conductive circuit a coating layer which comprises a metal layer and a coating film, the metal layer being formed on a surface of the first conductive circuit, the coating film being formed on the metal layer; forming a second interlayer resin insulation layer on the first interlayer resin insulation layer and the first conductive circuit; forming an opening portion in the second interlayer resin insulation layer such that the opening portion exposes a portion of the coating layer formed on the first conductive circuit; removing the portion of the coating layer exposed by the opening portion of the second interlayer resin insulation layer such that the opening portion penetrates through the second interlayer resin insulation layer and the coating layer and exposes a portion of the first conductive circuit; forming a second conductive circuit on the second interlayer resin insulation layer; and forming a via conductor in the opening portion of the second interlayer resin insulation layer such that the via conductor penetrates through the second interlayer resin insulation layer and the coating layer and connects the first conductive circuit and the second conductive circuit, wherein the forming of the coating layer comprises plating Sn such that the metal layer comprising Sn plating is formed on a surface of the first conductive circuit and forming the coating film comprising a coupling agent, and the removing of the coating layer comprises applying a permanganic acid solution to the portion of the coating layer such that the portion of the first conductive circuit is exposed and removing a resin residue resulting from the forming of the opening portion. ### Claim 2 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film. ### Claim 3 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the forming of the coating layer comprises forming the metal layer on an entire surface of the first conductive circuit over the first interlayer resin insulation layer. ### Claim 4 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the forming of the via conductor comprises forming a via conductor having a bottom portion which is entirely positioned on the first conductive circuit and which is directly connected to the first conductive circuit. ### Claim 5 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the forming of the coating layer comprises forming the metal layer on an entire surface of the first conductive circuit over the first interlayer resin insulation layer, and the forming of the via conductor comprises forming a via conductor having a bottom portion which is entirely positioned on the first conductive circuit and which is directly connected to the first conductive circuit. ### Claim 6 A method for manufacturing a multilayer printed wiring board, comprising: forming a first interlayer resin insulation layer; forming a first conductive circuit on the first interlayer resin insulation layer; forming on the first conductive circuit a coating layer which comprises a metal layer and a coating film, the metal layer being formed on a surface of the first conductive circuit, the coating film being formed on the metal layer; forming a second interlayer resin insulation layer on the first interlayer resin insulation layer and the first conductive circuit; forming an opening portion in the second interlayer resin insulation layer such that the opening portion exposes a portion of the coating layer formed on the first conductive circuit; removing the portion of the coating layer exposed by the opening portion of the second interlayer resin insulation layer such that the opening portion penetrates through the second interlayer resin insulation layer and the coating layer and exposes a portion of the first conductive circuit; forming a second conductive circuit on the second interlayer resin insulation layer; and forming a via conductor in the opening portion of the second interlayer resin insulation layer such that the via conductor penetrates through the second interlayer resin insulation layer and the coating layer and connects the first conductive circuit and the second conductive circuit, wherein the forming of the coating layer comprises plating Sn such that the metal layer comprising Sn plating is formed on a surface of the first conductive circuit and forming the metal layer on an entire surface of the first conductive circuit over the first interlayer resin insulation layer, and the removing of the coating layer comprises applying a permanganic acid solution to the portion of the coating layer such that the portion of the first conductive circuit is exposed and removing a resin residue resulting from the forming of the opening portion. ### Claim 7 A method for manufacturing a multilayer printed wiring board, comprising: forming a first interlayer resin insulation layer; forming a first conductive circuit on the first interlayer resin insulation layer; forming on the first conductive circuit a coating layer which comprises a metal layer and a coating film, the metal layer being formed on a surface of the first conductive circuit, the coating film being formed on the metal layer; forming a second interlayer resin insulation layer on the first interlayer resin insulation layer and the first conductive circuit; forming an opening portion in the second interlayer resin insulation layer such that the opening portion exposes a portion of the coating layer formed on the first conductive circuit; removing the portion of the coating layer exposed by the opening portion of the second interlayer resin insulation layer such that the opening portion penetrates through the second interlayer resin insulation layer and the coating layer and exposes a portion of the first conductive circuit; forming a second conductive circuit on the second interlayer resin insulation layer; and forming a via conductor in the opening portion of the second interlayer resin insulation layer such that the via conductor penetrates through the second interlayer resin insulation layer and the coating layer and connects the first conductive circuit and the second conductive circuit, wherein the forming of the coating layer comprises plating Sn such that the metal layer comprising Sn plating is formed on a surface of the first conductive circuit, the removing of the coating layer comprises applying a permanganic acid solution to the portion of the coating layer such that the portion of the first conductive circuit is exposed and removing a resin residue resulting from the forming of the opening portion, and the forming of the via conductor comprises forming a via conductor having a bottom portion which is entirely positioned on the first conductive circuit and which is directly connected to the first conductive circuit. ### Claim 8 (depends on 6) The method for manufacturing a multilayer printed wiring board according to claim 6, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film. ### Claim 9 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film, and the forming of the coating layer comprises forming the metal layer on an entire surface of the first conductive circuit over the first interlayer resin insulation layer. ### Claim 10 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film, and the forming of the via conductor comprises forming a via conductor having a bottom portion which is entirely positioned on the first conductive circuit and which is directly connected to the first conductive circuit. ### Claim 11 (depends on 6) The method for manufacturing a multilayer printed wiring board according to claim 6, wherein the forming of the via conductor comprises forming a via conductor having a bottom portion which is entirely positioned on the first conductive circuit and which is directly connected to the first conductive circuit. ### Claim 12 (depends on 7) The method for manufacturing a multilayer printed wiring board according to claim 7, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film. ### Claim 13 (depends on 7) The method for manufacturing a multilayer printed wiring board according to claim 7, wherein the forming of the coating layer comprises forming the coating film comprising a coupling agent, and the forming of the coating layer comprises forming the metal layer on an entire surface of the first conductive circuit over the first interlayer resin insulation layer. ### Claim 14 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film, the forming of the coating layer comprises forming the metal layer on an entire surface of the first conductive circuit over the first interlayer resin insulation layer, and the forming of the via conductor comprises forming a via conductor having a bottom portion which is entirely positioned on the first conductive circuit and which is directly connected to the first conductive circuit. ### Claim 15 (depends on 6) The method for manufacturing a multilayer printed wiring board according to claim 6, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film, and the forming of the via conductor comprises forming a via conductor having a bottom portion which is entirely positioned on the first conductive circuit and which is directly connected to the first conductive circuit. ### Claim 16 (depends on 7) The method for manufacturing a multilayer printed wiring board according to claim 7, wherein the forming of the second conductive circuit and the forming of the via conductor comprise forming an electroless plated film on the second interlayer resin insulation layer, an inner wall of the opening portion and a surface of the first conductive circuit exposed by the opening portion, and forming an electrolytic plated film on the electroless plated film, and the forming of the coating layer comprises forming the metal layer on an entire surface of the first conductive circuit over the first interlayer resin insulation layer. ### Claim 17 (depends on 1) The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the coupling agent is a silane coupling agent. ### Claim 18 (depends on 2) The method for manufacturing a multilayer printed wiring board according to claim 2, wherein the coupling agent is a silane coupling agent. ### Claim 19 (depends on 3) The method for manufacturing a multilayer printed wiring board according to claim 3, wherein the coupling agent is a silane coupling agent. ### Claim 20 (depends on 4) The method for manufacturing a multilayer printed wiring board according to claim 4, wherein the coupling agent is a silane coupling agent.