# US 9,038,264 B2 · Non-uniform vacuum profile die attach tip

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,038,264 B2
- Document ID: US9038264B2
- Status: Granted
- Kind: B2
- Application number: 13/265,656
- Filed: 2011-02-28
- Published: 2012-08-30
- Granted: 2015-05-26
- Earliest claimed: 2011-02-28
- Assignees: Sandisk Semiconductor (Shanghai) Co., Ltd.; SanDisk Information Technology (Shanghai) Co., Ltd.
- Applicants: Pradeep Kumar Rai; Kim Lee Bock; Li Wang; JinXiang Huang; EnYong Tai; JianHua Wang; King Hoo Ong
- Inventors: Pradeep Kumar Rai; Kim Lee Bock; Li Wang; JinXiang Huang; EnYong Tai; JianHua Wang; King Hoo Ong
- Web page: https://patentgrep.com/patent/US9038264B2

## CPC

- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 72/0711: {Apparatus therefor}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7438: {with parts of the auxiliary support remaining in the finished device}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/53191: Means to apply vacuum directly to position or hold work part
- Y10T 29/53283: Means comprising hand-manipulatable implement
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

## Claims

### Claim 1

A tool for separating a semiconductor die from a tape assembly, the tape assembly exerting larger forces around an outer periphery of the semiconductor die than toward a center of the semiconductor die, the tool comprising:
a vacuum tip having a first plurality of vacuum holes in a central area of a surface of the vacuum tip for exerting a first force toward the center of the semiconductor die, on a surface of the semiconductor die opposite a surface of the semiconductor die engaged by the tape, and the vacuum tip having a second plurality of vacuum holes in an outer periphery area, nearer the edges of the surface than the central area, for exerting a second force around the outer periphery of the semiconductor die, on the surface of the semiconductor die, the second plurality of holes being more closely spaced from each other than the first plurality of holes so that the second force is greater than the first force, the second force counteracting the greater forces of the tape assembly around the outer periphery of the semiconductor die, and the first force counteracting the lesser forces of the tape assembly toward the center of the semiconductor die so that the semiconductor die remains substantially flat when the vacuum tip lifts the semiconductor die off the tape assembly.

### Claim 2 (depends on 1)

The tool recited in claim 1, wherein adhesive forces between the semiconductor die and the tape assembly define a first force profile across a surface of the semiconductor die, a low pressure communicated to the plurality of vacuum holes defining a second force profile in an opposite direction than the first force profile, the net force profile between the first and second force profiles resulting in a force profile that is larger at edges of the semiconductor die than in a center of the semiconductor die.

### Claim 3 (depends on 1)

The tool recited in claim 1, wherein the plurality of vacuum holes are provided in a configuration where the vacuum holes provide a vacuum force on the die which decreases proportionally to a square of the distance away from an edge.

### Claim 4 (depends on 1)

The tool recited in claim 1, wherein adhesive forces between the semiconductor die and the tape assembly define a first force profile across a surface of the semiconductor die, a low pressure communicated to the plurality of vacuum holes defining a second force profile in an opposite direction than the first force profile, the net force profile between the first and second force profiles resulting in a uniform force profile across the surface of the semiconductor die.

### Claim 5 (depends on 4)

The tool recited in claim 4, the first and second profiles varying proportionally to a square of the distance from an edge of the semiconductor die.