Patterning
AssigneeCambridge Enterprise Limited
InventorsHenning Sirringhaus, Jui-Fen Chang, Michael Gwinner
Life of this patent
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Abstract
The present invention provides a method of patterning an electronic or photonic material on a substrate comprising: forming a film of said electronic or photonic material on said substrate; and using a fluoropolymer to protect regions of said electronic or photonic material during a patterning process.
Claims33
A method of patterning an electronic or photonic material on a substrate comprising:
- (a) forming a film of said electronic or photonic material on said substrate;
- (b) depositing a fluoropolymer as a layer on said film of said electronic or photonic material;
- (c) depositing a light sensitive layer on said fluoropolymer;
- (d) patterning said electronic or photonic material using photolithography and etching;
- and
- (e) removing regions of the light sensitive layer that remain after said patterning, wherein said fluoropolymer protects regions of said electronic or photonic material during one or more of steps (c), (d) and (e).
A method of making an electronic device on a substrate comprising:
- forming a film of an organic semi conductor material on said substrate;
- depositing a fluoropolymer as a layer on said film of said electronic or photonic material;
- depositing a light sensitive layer on said fluoropolymer;
- patterning said film of organic semi conductor material by using a fluoropolymer to protect regions of said organic semi conductor material during the patterning process;
- and
- removing regions of the light sensitive layer and the fluoropolymer that remain after patterning,
- wherein, in operation, said electronic device utilizes current flow through the surface of said organic semi conductor material which is in contact with the protective layer during patterning.
A method of patterning at least a first electronic or photonic material and a second electronic or photonic material on a substrate comprising:
- (A) patterning said first electronic or photonic material on a substrate by a method comprising:
- forming a film of said first electronic or photonic material on said substrate;
- depositing a fluoropolymer as a layer on said film of said electronic or photonic material;
- and
- using said fluoropolymer to protect regions of said electronic or photonic material during a patterning process;
- and
- (B) patterning said second electronic or photonic material by a method comprising:
- forming a film of said second electronic or photonic material on the pattern resulting from step (A);
- and
- selectively removing those regions of second electronic or photonic material having underlying fluoropolymer.
A method of patterning at least a first electronic or photonic material and a second electronic or photonic material on a substrate comprising:
- (a) patterning said first electronic or photonic material on a substrate by a method comprising:
- forming a film of said first electronic or photonic material on said substrate;
- depositing a fluoropolymer as a layer on said film of said electronic or photonic material;
- and
- using said fluoropolymer to protect regions of said electronic or photonic material during a patterning process;
- (b) depositing a further layer of fluoropolymer on said pattern of first electronic or photonic material and patterning said protective polymer;
- and
- (c) forming a film of said second electronic or photonic material on the pattern resulting from step (b);
- and
- (d) selectively removing those regions of second electronic or photonic material having underlying fluoropolymer.
A method of patterning an electronic or photonic material on a substrate comprising:
- (a) forming a film of said electronic or photonic material on said substrate;
- (b) depositing a fluoropolymer as a layer on said film of said electronic or photonic material;
- (c) depositing a surface energy modification layer on said fluoropolymer layer;
- (d) depositing a light sensitive layer on said surface energy modification layer;
- (e) patterning said electronic or photonic material using photolithography and etching;
- and
- (f) removing regions of the light sensitive layer that remain after patterning, wherein said fluoropolymer protects regions of said electronic or photonic material during one or more of steps (d), (e) and (f).
Dependencies are inferred from the claim text.