Hem flange joint

A process for producing a hem flange adhesive bond, comprising at least the steps of:

• a) applying an adhesive which has a viscosity at 25° C. of >900 Pa·s to an inner panel or to an outer panel, wherein the adhesive contains a spacer, wherein the adhesive is a heat-curing one-component epoxy resin adhesive comprising:
• at least one epoxy resin A with an average of more than one epoxy group per molecule,
• at least one hardener B for epoxy resins which is activated by elevated temperature,
• at least one terminally capped polyurethane prepolymer of formula (I):
• where R1 is a p-valent radical of an isocyanate-terminated linear or branched polyurethane prepolymer PU1 after removal of the terminal isocyanate groups,
• p is from 2 to 8, and
• R2 is independently a substituent selected from the group consisting of
• where
• R5, R6, R7 and R8 are each independently an alkyl or cycloalkyl or aralkyl or arylalkyl group, or R3 together with R6, or R7 together with R8, form part of a 4- to 7-membered ring which is at most substituted,
• R9, R9′ and R10 are each independently an alkyl or aralkyl or arylalkyl group, or an alkyloxy or aryloxy or aralkyloxy group,
• R11 is an alkyl group,
• R12, R13 and R14 are each independently an alkylene group which has 2 to 5 carbon atoms and optionally has double bonds or is substituted, or a phenylene group or a hydrogenated phenylene group,
• R15, R16 and R17 are each independently H or an alkyl group or an aryl group or aralkyl group,
• R18 is an aralkyl group or a mono- or polycyclic, substituted or unsubstituted aromatic group which optionally has aromatic hydroxyl groups, and
• m is 1, 2 or 3;
• b) contacting the adhesive with the inner panel or the outer panel;
• c) flanging the outer panel around the inner panel such that the adhesive is present in the interior of the hem flange;
• d) pressing the hem flange;
• and
• e) introducing thermal energy into the adhesive;
• wherein step d) or step e) is followed by a step g) of sealing the hem flange with a sealant.