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US 9,028,643 B2Granted
Methods of bonding and articles formed thereby
AssigneeCorning Incorporated
InventorScott Mathew Bennett
Life of this patent
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Abstract
A method of bonding a polymer film to a mating part, including: placing a mating part in a nest; contacting the polymer film and the mating part; heating a die including a thermally conductive silicone to a temperature at or above a glass transition temperature of the polymer film, the mating part, or both; actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article; and actuating the die away from the polymer film.
Claims18
A method of bonding a polymer film to a mating part, comprising:
- placing a mating part in a nest;
- contacting the polymer film and the mating part;
- heating a die consisting essentially of a thermally conductive silicone and a thermally conductive backer to a temperature at least about 100 degrees C. above a glass transition temperature of the polymer film, the mating part, or both, wherein the thermally conductive silicone is located on the backer;
- actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article;
- and
- actuating the die away from the polymer film.
3 more elements
Dependencies are inferred from the claim text.