High performance, small form factor connector
AssigneeAmphenol Corporation
InventorsBrian Kirk, Vijay Kasturi
Life of this patent
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AssigneeAmphenol Corporation
InventorsBrian Kirk, Vijay Kasturi
Estimating the term…
Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.
An electrical connector, comprising:
An electronic assembly, comprising:
An electronic assembly, comprising:
An electronic assembly, comprising:
An electrical connector adapted for mounting to a planar substrate, the electrical connector comprising:
An electrical connector, comprising:
An electronic assembly, comprising:
An electrical connector, comprising:
Dependencies are inferred from the claim text.