Back to results
US 9,021,684 B2Granted
Method of fabricating a slip ring component
AssigneeTyco Electronics Corporation
InventorsWilliam Gary Lenker, Gregory Gordon Griffith, Edward John Howard
Life of this patent
Estimating the term…
Abstract
A process of fabricating a slip ring component, a slip ring component, and a slip ring assembly are disclosed. The process includes forming a first shot, forming a second shot, and immersion bathing the first shot and the second shot. The immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot.
Claims20
A process of fabricating a slip ring component, the process comprising:
- forming a first shot;
- forming a second shot;
- securing the first shot and the second shot together;
- then
- immersion bathing the first shot and the second shot;
- then
- positioning the slip ring component on a rotor shaft;
- wherein the first shot is non-plateable and the second shot is plateable;
- and
- wherein the immersion bathing selectively applies an electrically conductive plating to exposed surfaces of the second shot but not the first shot;
- wherein the slip ring component has a contact interface on the second shot extending inwardly toward the rotor shaft such that the contact interface protrudes over at least a portion of the first shot.
8 more elements
A process of fabricating a slip ring component, the process comprising:
- forming a first shot;
- forming a second shot with a conductive polymer;
- and
- immersion bathing the first shot and the second shot;
- then
- positioning the slip ring component on a rotor shaft;
- wherein the immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot;
- and
- wherein the first shot electrically insulates the electrically conductive plating on the second shot;
- wherein the slip ring component has a contact interface on the second shot extending inwardly toward the rotor shaft such that the contact interface protrudes over at least a portion of the first shot.
7 more elements
A process of fabricating a slip ring component, the process comprising:
- injection molding a first shot, the first shot being resistant to immersion plating;
- injection molding a second shot, the second shot being capable of receiving an application of metal through immersion plating;
- securing the first shot and the second shot together, the securing being selected from the group consisting of bonding during injection molding, keying features, adhesive, ultrasonic welding, interference fit, and combinations thereof;
- then
- immersion bathing the first shot and the second shot;
- then
- positioning the slip ring component on a rotor shaft;
- wherein the immersion bathing selectively applies an electrically conductive plating to exposed surfaces of the second shot but not the first shot;
- and
- wherein the second shot includes a contact interface, the contact interface protruding over at least a portion of the first shot.
7 more elements
Dependencies are inferred from the claim text.