Electro chemical deposition and replenishment apparatus

A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the process electrolyte replenishment module comprising:

• a frame offset from the chemical deposition apparatus;
• a process electrolyte recirculation compartment disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus;
• an anode compartment in the frame coupled to the process electrolyte recirculation compartment, the anode compartment having a second anode, that is a soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte;
• a buffer compartment in the frame coupled to the process electrolyte recirculation compartment, the buffer compartment having a buffer solution therein, and having a second ion exchange membrane separating the buffer solution from the process electrolyte;
• an cathode compartment in the frame coupled to the buffer compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a third ion exchange membrane separating the secondary catholyte from the buffer solution;
• and
• a ion removal cell coupled to the buffer compartment;
• wherein, buffer solution from the buffer compartment is recirculated through the ion removal cell with the ion removal cell removing unwanted ions from the buffer solution.

An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the electrochemical deposition apparatus comprising:

• a deposition module having a deposition module frame configured to hold a process electrolyte;
• a substrate holder removably coupled to the deposition module frame, the substrate holder supporting the substrate, the process electrolyte contacting the surface of the substrate, the substrate acting as a first cathode;
• a first soluble anode coupled to the deposition module frame;
• a process electrolyte replenishment module adapted to replenish ions in the process electrolyte, the process electrolyte replenishment module having a replenishment module frame offset from the deposition module;
• a process electrolyte recirculation compartment disposed in the replenishment module frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition module;
• an anode compartment in the replenishment module frame coupled to the process electrolyte recirculation compartment, the anode compartment having a second soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte, the first ion exchange membrane being a cationic membrane;
• a buffer compartment in the frame coupled to the process electrolyte recirculation compartment, the buffer compartment having a buffer solution therein, and having a second ion exchange membrane separating the buffer solution from the process electrolyte;
• and
• a cathode compartment in the replenishment module frame coupled to the process electrolyte recirculation compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a third ion exchange membrane separating the secondary catholyte from the process electrolyte, the third ion exchange membrane being a monovalent selective membrane;
• wherein, both the first soluble anode and the second soluble anode replenish ions in the process electrolyte depleted by ion deposition onto the surface.

An electrochemical deposition apparatus adapted to deposit metal onto a surface of a substrate, the electrochemical deposition apparatus comprising:

• a deposition module having a deposition module frame configured to hold a process electrolyte;
• a substrate holder removably coupled to the deposition module frame, the substrate holder supporting the substrate, the process electrolyte contacting the surface of the substrate, the substrate acting as a first cathode;
• a first soluble anode coupled to the deposition module frame;
• a process electrolyte replenishment module adapted to replenish ions in the process electrolyte, the process electrolyte replenishment module having a replenishment module frame offset from the deposition module;
• a process electrolyte recirculation compartment disposed in the replenishment module frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition module;
• an anode compartment in the replenishment module frame coupled to the process electrolyte recirculation compartment, the anode compartment having a second soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte;
• a buffer compartment in the replenishment module frame coupled to the process electrolyte recirculation compartment, the buffer compartment having a buffer solution therein, and having a second ion exchange membrane separating the buffer solution from the process electrolyte;
• and
• a cathode compartment in the replenishment module frame coupled to the buffer compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a third ion exchange membrane separating the secondary catholyte from the buffer solution;
• wherein, both the first soluble anode and the second soluble anode replenish ions in the process electrolyte depleted by ion deposition onto the surface.

An electrochemical deposition system including an electrochemical deposition apparatus and a process electrolyte replenishment module adapted to deposit metal onto a surface of a substrate, the electrochemical deposition apparatus comprising:

• a deposition module having a deposition module frame configured to hold a process electrolyte;
• a substrate holder removably coupled to the deposition module frame, the substrate holder supporting the substrate, the process electrolyte contacting the surface of the substrate, the substrate acting as a first cathode;
• a first soluble anode coupled to the deposition module frame;
• and
• the deposition module having a configurable process electrolyte replenishment module interface port configured in a first configuration to interface with the process electrolyte replenishment module and configured in a second configuration to not interface with process electrolyte replenishment module,
• wherein the process electrolyte replenishment module is not part of the electrochemical deposition apparatus, and
• wherein, in the first configuration the interface port includes
• (i) a first port that provides fluid communication between a replenishment compartment of the replenishment module and a cathode compartment of the deposition module, and
• (ii) a second port that provides fluid communication between an anode compartment of the replenishment module and an anode compartment of the deposition module.