Integrated MEMS design for manufacturing

An integrated circuit die comprising:

• a microelectromechanical system (MEMS) device formed using a MEMS structural layer of the integrated circuit die,
• a monitor structure configured to generate an indicator of a device parameter of the MEMS device, the monitor structure being formed using the MEMS structural layer;
• and
• a complementary metal-oxide semiconductor (CMOS) circuit configured to generate a signal indicative of the device parameter based on the indicator, the signal being generated in a first mode of operation of the integrated circuit.

An integrated circuit die comprising:

• a microelectromechanical system (MEMS) device formed using a MEMS structural layer of the integrated circuit die,
• a monitor structure configured to generate an indicator of a device parameter of the MEMS device;
• and
• a complementary metal-oxide semiconductor (CMOS) circuit configured to generate a signal indicative of the device parameter based on the indicator, the signal being generated in a first mode of operation of the integrated circuit,
• wherein the monitor structure includes a partitioned electrode of the MEMS device.

A method of manufacturing an apparatus comprising:

• forming a microelectromechanical system (MEMS) device using a MEMS structural layer of the integrated circuit die;
• and
• forming a monitor structure using the MEMS structural layer of the integrated circuit die, the monitor structure being configured to generate an indicator of a device parameter of the MEMS device;
• and
• forming a complementary metal-oxide semiconductor (CMOS) circuit configured to generate a signal indicative of the device parameter in a first mode of operation of the integrated circuit.