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US 9,005,736 B2Granted
Electronic component manufacturing method
AssigneeMurata Manufacturing Co., Ltd.
InventorHidemasa Kawai
Life of this patent
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Abstract
An electronic component manufacturing method that efficiently grinds a cover layer provided on a substrate even when the substrate is warped includes the step of forming first grooves at intervals in a cover layer provided on a substrate by repeating grinding with a rotary blade at a pitch more than a thickness W of the rotary blade. Next, at least portions provided in the cover layer along the first grooves are removed to reduce the thickness of the cover layer by repeating grinding at a pitch equal to or less than the thickness W of the rotary blade.
Claims3
An electronic component comprising:
- a substrate;
- a component mounted on the substrate;
- and
- a cover layer provided on the substrate and arranged to cover the component;
- wherein
- a surface of the cover layer includes a plurality of first recesses extending in a first direction and a plurality of second recesses extending in a second direction different from the first direction;
- no surface of the component is exposed to an outside of the surface of the cover layer;
- the plurality of first recesses are spaced apart from one another at a first pitch;
- the plurality of second recesses are spaced apart from one another at a second pitch that is smaller than the first pitch;
- and
- at least one of the plurality of first recesses and the plurality of second recesses is arranged directly above the component.
8 more elements
Dependencies are inferred from the claim text.