Skew compensation for a stacked die
AssigneeXilinx, Inc.
InventorsKhaldoon S. Abugharbieh, Daniel J. Ferris, III, Loren Jones, Austin H. Lesea
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AssigneeXilinx, Inc.
InventorsKhaldoon S. Abugharbieh, Daniel J. Ferris, III, Loren Jones, Austin H. Lesea
Estimating the term…
An embodiment for skew compensation for a stacked die is disclosed. For an embodiment of an apparatus, an interposer has a first and a second integrated circuit die coupled to the interposer. The first integrated circuit die includes an information generator, a signal delay compensator, and an input/output block. The information generator is configured to determine: a first delay value for a first path of the interposer between the first integrated circuit die and the second integrated circuit die; a second delay value for a second path of the interposer between the first integrated circuit die and the second integrated circuit die; and a difference between the first delay value and the second delay value. The signal delay compensator is coupled to receive the difference and configured to adjust a parameter of the first integrated circuit die to reduce the difference.
An apparatus, comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.