MEMS microphone package with molded interconnect device

A top-ported microphone package comprising:

• a molded interconnect device lid formed of moldable thermoplastic material and including
• a conductive lid trace extending along an interior surface of the plastic lid and
• an electrical shielding, wherein the electrical shielding does not overlap with the first conductive lid trace;
• an acoustic port opening formed through a top surface of the moldable interconnect device lid;
• a MEMS microphone die mounted on an interior surface of the moldable interconnect device lid adjacent to the acoustic port opening, the MEMS microphone die being electrically coupled to the conductive lid trace;
• a base substrate coupled to the moldable interconnect device lid to form a sealed cavity, the base substrate including a conductive substrate trace on the interior of the sealed cavity arranged to form an electrical connection with the conductive lid trace;
• and
• an electrical contact pad mounted on an exterior surface of the base substrate and electrically coupled to the conductive substrate trace such that the electrical connection between the conductive substrate trace and the conductive lid trace provides electrical coupling between the electrical contact pad and the MEMS microphone die,
• wherein the first conductive lid trace extends along the interior surface of the sealed cavity from a first location proximal to the second component to a second location that forms the electrical connection with the first conductive substrate trace.

A bottom-ported microphone package comprising:

• a base substrate including a conductive substrate trace on a first surface of the base substrate;
• an acoustic port opening formed through the base substrate;
• a MEMS microphone die mounted on the first surface of the base substrate adjacent to the acoustic port opening, the MEMS microphone die being electrically coupled to the conductive substrate trace;
• a molded interconnect device lid formed of moldable thermoplastic material and being coupled to the base substrate to form a sealed cavity, the first surface of the base substrate being on the interior of the sealed cavity, the moldable interconnect device lid including a conductive lid trace arranged to form an electrical connection with the conductive substrate trace,
• wherein the molded interconnect device lid includes an electrical shielding that does not overlap with the conductive lid trace;
• and
• an electrical contact pad mount on an exterior surface of the moldable interconnect device lid and electrically coupled to the conductive lid trace such that the electrical connection between the conductive substrate trace and the conductive lid trace provides electrical coupling between the electrical contact pad and the MEMS microphone die,
• wherein the conductive lid trace extends along an interior surface of the moldable interconnect device lid from a first location proximal to the electrical connection pad to a second location that forms the electrical connection between the conductive substrate trace and the conductive lid trace.