Diode laser bar mounted on a copper heat-sink
AssigneeCoherent, Inc.
InventorsSergei Govorkov, John H. Jerman
Life of this patent
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Abstract
A diode-laser bar package includes a water cooled metal heat-sink. An electrical-insulator-plate is bonded to the heat-sink with a soft solder. A metal sub-mount and a first electrode are bonded, spaced apart, on the electrical-insulator-plate. A solder-bridge fills the space between the first electrode and the sub-mount. A diode-laser bar is bonded to the sub-mount. A second electrode is bonded to the first electrode with an electrically insulating bond. Electrical connection between the second electrode and the diode-laser bar is made by a plurality of wire-bond electrical leads.
Claims20
Laser apparatus, comprising
- a metal heat-sink;
- an electrical-insulator-plate bonded to the heat-sink with a soft solder;
- a metal sub-mount and a first electrode bonded, spaced apart, on the electrical-insulator-plate using a hard solder, with that hard solder filling the space between the first electrode and the sub-mount;
- a diode-laser bar bonded to the sub-mount with a hard solder;
- a second electrode bonded to the first electrode and insulated therefrom by an epoxy bond;
- and
- a plurality of wire-bond electrical connections between the second electrode and the diode-laser bar.
Laser apparatus, comprising
- a copper heat-sink;
- a beryllium oxide electrical-insulator-plate bonded to the heat-sink with a soft solder;
- a copper tungsten sub-mount and a first electrode bonded, spaced apart, on the electrical-insulator-plate using a hard solder, with that hard solder filling the space between the first electrode and the sub-mount;
- a diode-laser bar on a gallium arsenide substrate bonded to the sub-mount with a hard solder;
- a second electrode formed from a copper-molybdenum-copper composite bonded to the first electrode and insulated therefrom by a glass-filled epoxy bond;
- and
- a plurality of wire-bond electrical connections between the second electrode and the diode-laser bar.
Dependencies are inferred from the claim text.