Back to results
US 9,001,524 B1Granted
Switch-mode power conversion IC package with wrap-around magnetic structure
AssigneeMaxim Integrated Products, Inc.
InventorSunil M. Akre
Life of this patent
Estimating the term…
Abstract
An integrated circuit device includes a support for supporting electrical circuitry, an integrated circuit having electrical circuitry disposed on the support, and a magnetic portion attached to the support around the integrated circuit. The integrated circuit and the magnetic portion are interconnected for converting a power input signal having a first characteristic to a power output signal having a second characteristic different from the first characteristic.
Claims20
An integrated circuit device comprising:
- a support for supporting electrical circuitry;
- an integrated circuit having electrical circuitry disposed on the support;
- and
- a magnetic portion attached to the support and wrapped around the periphery of the integrated circuit, the integrated circuit and the magnetic portion interconnected for converting a power input signal having a first characteristic to a power output signal having a second characteristic different from the first characteristic, wherein the support comprises a projection separating the magnetic portion from the integrated circuit and disposed between the integrated circuit and the magnetic portion along the entirety of the periphery of the integrated circuit that shields the integrated circuit from the magnetic portion.
1 more element
A process comprising:
- forming a support for supporting electrical circuitry;
- forming an integrated circuit having electrical circuitry disposed on the support;
- wrapping a magnetic portion around the periphery of the integrated circuit;
- and
- interconnecting the integrated circuit and the magnetic portion for converting a power input signal having a first characteristic to a power output signal having a second characteristic different from the first characteristic, wherein the support comprises a projection separating the magnetic portion from the integrated circuit and disposed between the integrated circuit and the magnetic portion along the entirety of the periphery of the integrated circuit that shields the integrated circuit from the magnetic portion.
2 more elements
An integrated circuit device comprising:
- a lead-frame having a thermal interface;
- an integrated circuit having electrical circuitry disposed on a die attached to the lead-frame and coupled to the thermal interface of the lead-frame;
- and
- a winding of conductive material attached to the lead-frame and wrapped around the periphery of the die, the integrated circuit and the winding of conductive material interconnected for converting a power input signal having a first characteristic to a power output signal having a second characteristic different from the first characteristic, wherein the lead-frame comprises a projection separating the winding of conductive material from the integrated circuit and disposed between the integrated circuit and the winding of conductive material along the entirety of the periphery of the integrated circuit that shields the integrated circuit from the winding of conductive material.
1 more element
Dependencies are inferred from the claim text.