Substrate fixing device and method for manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorsTakayuki Fukasawa, Ji-Hun Kim, Sang-Gab Kim, Hyun-Min Cho
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Abstract
In a substrate fixing device and a method form manufacturing the substrate fixing device, the substrate fixing device includes a lower electrode, a dielectric layer and a plurality of protrusions. The dielectric layer is disposed on the lower electrode. The protrusions are spaced apart from each other, and are protruded from the dielectric layer. Each of the protrusions includes an insulating layer disposed on the dielectric layer, and an upper layer disposed on the insulating layer and contacting a substrate.
Claims26
A substrate fixing device comprising:
- a lower electrode;
- a dielectric layer including:
- a first surface on which the lower electrode is disposed, and
- a second surface which is opposite to the first surface;
- and
- a plurality of protrusions spaced apart from each other, and protruded from the second surface of the dielectric layer,
- wherein each protrusion comprises:
- an insulating layer on the dielectric layer;
- and
- an upper layer on the insulating layer and contacting a substrate.
A substrate fixing device comprising:
- a lower electrode;
- a dielectric layer including:
- a first surface on which the lower electrode is disposed;
- and
- a second surface which is opposite to the first surface;
- a porous layer disposed on the second surface of the dielectric layer;
- and
- a plurality of protrusions spaced apart from each other, and protruding from the second surface of the dielectric layer and through the porous layer,
- wherein each protrusion comprises an insulating layer on the dielectric layer.
A method for manufacturing a substrate fixing device, the method comprising:
- providing a dielectric layer on a lower electrode;
- providing a mask including an opening portion defined therein, on the dielectric layer;
- providing an insulating material in the opening portion defined in the mask;
- drying the insulating material provided in the opening portion, to form a stepped portion between the mask and the insulating material;
- providing a hard material on the mask and the insulating material;
- and
- removing the mask to form a protrusion comprising an insulating layer comprising the insulating material and an upper layer comprising the hard material.
A method for manufacturing a substrate fixing device, the method comprising:
- providing a lower electrode on a first surface of a dielectric layer;
- providing an insulating material on a predetermined position of the dielectric layer, to form an insulating layer of a plurality of protrusions spaced apart from each other on a second surface of the dielectric layer which is opposite to the first surface;
- and
- providing a hard material on the insulating layer, to form an upper layer of the protrusions.
A method for manufacturing a substrate fixing device, the method comprising:
- providing a dielectric layer on a lower electrode;
- providing a porous layer on the dielectric layer;
- providing a mask on the porous layer on the dielectric layer, and partially removing the porous layer using the mask;
- providing an insulating material in an opening portion of the mask on the dielectric layer;
- and
- removing the mask, to form a protrusion comprising an insulating layer comprising the insulating material.
Dependencies are inferred from the claim text.