Complex passive design with special via implementation

An integrated passive device, comprising:

• a substrate;
• first means for conducting electricity, positioned over the substrate;
• second means for conducting electricity, positioned over the first conducting means;
• means for electrically isolating the first conducting means and the second conducting means, positioned between a portion of the first conducting means and the second conducting means;
• and
• means for providing electrical connection in the electrically isolating means between the first conducting means and the second conducting means, wherein the means for providing electrical connection is defined by a hole in the electrically isolating means, the hole being at least partially filled by the second conducting means, and wherein a width of the hole is greater than a width of each of the first conducting means and the second conducting means, both widths being lateral dimensions of the device.

A method of manufacturing an integrated passive device, comprising:

• providing a substrate;
• depositing a first conductive trace over the substrate;
• depositing a first interlayer dielectric over the first conductive trace;
• forming a hole in the first interlayer dielectric, wherein a width of the hole is greater than a width of the first conductive trace, the hole defining a via for electrical interconnection between conductive traces;
• depositing a second conductive trace in the hole over the first conductive trace to form the via, wherein the width of the hole is greater than a width of the second conductive trace, both widths being lateral dimensions of the device;
• and
• depositing a second interlayer dielectric over the second conductive trace.