Inductor for post passivation interconnect
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu
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Abstract
An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member.
Claims16
An inductor device, comprising:
- a post passivation interconnect (PPI) layer disposed over a substrate, the PPI layer forming a coil and dummy pads, the dummy pads disposed around a substantial portion of the coil to shield the coil from electromagnetic interference;
- and
- an under bump metallization (UBM) layer disposed over the substrate, a first portion of the UBM layer electrically coupled to the coil and configured to interface with an electrical coupling member.
An inductor device, comprising:
- a post passivation interconnect (PPI) layer disposed over a substrate, the PPI layer forming a coil contact pad and dummy pads to shield a coil from electromagnetic interference;
- and
- an under bump metallization (UBM) layer disposed over the substrate, a first portion of the UBM layer forming the coil, the coil substantially disposed within the dummy pads, electrically coupled to the coil contact pad, and configured to interface with an electrical coupling member.
Dependencies are inferred from the claim text.