Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
AssigneeWemtec, Inc.
InventorWilliam E. McKinzie, III
Life of this patent
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Abstract
A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.
Claims23
A surface wave suppression structure comprised of;
- a conductive surface,
- a resistive sheet spaced apart from the conductive surface, and
- an array of posts which electrically connect the conductive surface to the resistive sheet,
- wherein the posts have a resistance of less than about 20 ohms.
A method of fabricating a structure, comprising:
- providing a dielectric substrate, having a pattern of posts formed between opposing surfaces thereof;
- forming a patterned resistive layer on a first surface of the dielectric substrate;
- and
- forming a conductive layer on a second surface of the dielectric layer opposing the resistive layer, such that the posts connect the resistive layer to the conductive layer,
- wherein the spacing, shape, dimensions and conductivity of the posts, and the dimensions and shape of the patterned resistive layer are selected such that the propagation of TM modes is suppressed in amplitude over a desired frequency band;
- and, the posts have a resistance of less than about 20 ohms.
A method for suppressing parallel-plate waveguide (PPW) modes, the method comprising:
- providing a first conductive surface, and a second conductive surface, disposed parallel to the first conductive surface;
- at least one of the first conductive surface or the second conductive surface forming a part of a radio frequency circuit package;
- providing a substrate disposed between the first and second conductive surfaces;
- providing a resistive sheet formed on the substrate;
- selecting an intrinsic resistance value of the resistive sheet to form an effective sheet resistance R;
- providing an array of vias electrically connecting the resistive sheet to one of the first or the second conductive surfaces;
- and
- selecting the size and spacing of the array of vies, the separation distance between the first and the second conductive surfaces, and the effective sheet resistance R to suppress propagation of TM modes over a desired frequency band,
- wherein the vias have a resistance of less than about 20 ohms.
A method of fabricating a circuit assembly for use in a package having opposing conductive surfaces spaced apart, comprising:
- providing a first dielectric layer having a first relative dielectric constant and a thickness;
- forming an array of posts connecting opposing surfaces of the first dielectric layer;
- forming a conductive layer on one of the surfaces of the first dielectric layer, connecting an end of the posts;
- forming a resistive layer on another of the surfaces of the first dielectric layer, connecting another end of the posts;
- and
- processing the resistive layer so as to form a geometric pattern,
- wherein the posts have a resistance of less than about 20 ohms.
Dependencies are inferred from the claim text.