Semiconductor device with redistributed contacts

A surface mount semiconductor device having first and second opposed faces and a side surface transverse to said opposed faces, the device comprising:

• a semiconductor die having an active face presenting a die set of electrical contact elements and a further die face opposite said active face;
• a metallic member with bar elements extending beside said semiconductor die to said side surface;
• a molding compound extending to said first face and to said side surface and embedding said metallic member and said further die face of said semiconductor die;
• a device set of electrical contact elements at said second face;
• and
• a redistribution layer including a layer of insulating material extending to said side surface, and redistribution conductors within said insulating material interconnecting said electrical contact elements of said die set with said electrical contact elements of said device set;
• wherein said bar elements have recesses at said side surface such that said molding compound is interposed between said metallic member and said insulating material of said redistribution layer at said side surface.