Semiconductor device and manufacturing method thereof
AssigneeAmkor Technology, Inc.
InventorsWon Chul Do, Doo Hyun Park, Jong Sik Paek, Ji Hun Lee, Seong Min Seo
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Abstract
Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer, encapsulating the semiconductor die by using an encapsulation, removing the dummy substrate from the interposer, and connecting a bump to the redistribution layer facing a lower portion of the interposer.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- forming an interposer comprising a redistribution layer and a dielectric layer on a dummy substrate;
- connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer;
- encapsulating the semiconductor die in an encapsulant;
- removing the dummy substrate from the interposer;
- and
- thinning the encapsulant.
A method of manufacturing a semiconductor device, the method comprising:
- forming an interposer comprising a redistribution layer and a dielectric layer on a dummy substrate;
- and
- removing the dummy substrate from the interposer, wherein said removing the dummy substrate comprises grinding the dummy substrate.
A method of manufacturing a semiconductor device, the method comprising:
- forming an interposer comprising:
- a redistribution layer and a dielectric layer;
- and
- an under bump metal on which at least a portion of the redistribution layer is formed;
- connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer;
- encapsulating the semiconductor die by using an encapsulant;
- thinning the encapsulant to expose a top surface of the semiconductor die;
- and
- connecting a bump to the under bump metal.
Dependencies are inferred from the claim text.