Power semiconductor module and power conversion device

A method of manufacturing a power semiconductor module, the power semiconductor module including:

• a circuit body including:
• a semiconductor element;
• and
• a conductor plate connected to an electrode plane of the semiconductor element through solder;
• and
• a metal case including:
• a first heat dissipating plate facing one surface of the circuit body;
• a second heat dissipating plate facing another surface of the circuit body opposite to the one surface thereof;
• and
• an intermediate member which connects the first heat dissipating plate and the second heat dissipating plate and includes an opening into which the circuit body is inserted,
• the method comprising:
• a first step of inserting the circuit body from the opening of the case;
• a second step of deforming a part of the intermediate member of the case while holding the circuit body between the first heat dissipating plate and the second heat dissipating plate;
• a third step of further deforming a part of the intermediate member of the case;
• and
• a fourth step of performing high-temperature treatment on the case and the circuit body.

A power conversion device comprising:

• a power semiconductor module including:
• a power semiconductor element which converts DC current into AC current;
• a circuit body having a conductor member connected to the power semiconductor element;
• a case in which the circuit body is housed;
• and
• a joint member which connects the circuit body and the case;
• and
• a passage forming body which forms a passage through which a cooling medium that cools the power semiconductor element flows,
• wherein the case includes:
• a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between;
• a side wall which joins the first heat dissipating member and the second heat dissipating member;
• and
• an intermediate member which is formed on a periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case, and
• the case is fixed to the passage forming body in order for the first heat dissipating member and the second heat dissipating member to be in direct contact with the cooling medium.