Semiconductor package
AssigneeMediatek Inc.
InventorsTai-Yu Chen, Chung-Fa Lee, Wen-Sung Hsu, Shih-Chin Lin
Life of this patent
Estimating the term…
Abstract
A semiconductor package with reduced warpage problem is provided, including: a circuit board, having opposing first and second surfaces; a semiconductor chip, formed over a center portion of the first surface of the circuit board, having a first cross sectional dimension; a spacer, formed over a center portion of the semiconductor chip, having a second cross sectional dimension less than that of the first cross sectional dimension; an encapsulant layer, formed over the circuit board, covering the semiconductor chip and surrounding the spacer; a heat spreading layer, formed over the encapsulant layer and the spacer; and a plurality of solder balls, formed over the second surface of the circuit board.
Claims19
A semiconductor package, comprising:
- a circuit board, having opposing first and second surfaces;
- a semiconductor chip, formed over a center portion of the first surface of the circuit board, having a first cross sectional dimension;
- a spacer, formed over a center portion of the semiconductor chip, having a second cross sectional dimension less than that of the first cross sectional dimension;
- an encapsulant layer, formed over the circuit board, covering the semiconductor chip and surrounding the spacer;
- a heat spreading layer, formed over the encapsulant layer and the spacer;
- and
- a plurality of solder balls, formed over the second surface of the circuit board, wherein the semiconductor chip is a functional chip and the spacer is a non-functional chip, wherein the spacer comprises a semiconductor material which is the same as that of the semiconductor chip.
A semiconductor package, comprising:
- a circuit board, having opposing first and second surfaces;
- a semiconductor chip, formed over a center portion of the first surface of the circuit board;
- a stiffner, formed over an edge portion of the first surface of the circuit board, surrounding the semiconductor chip;
- an encapsulant layer, formed over the circuit board, covering the semiconductor chip and surrounded by the stiffner;
- a heat spreading layer, formed over the encapsulant layer and the stiffner;
- and
- a plurality of solder balls, formed over the second surface of the circuit board.
A semiconductor package, comprising:
- a circuit board, having opposing first and second surfaces;
- a semiconductor chip, formed over a center portion of the first surface of the circuit board;
- an encapsulant layer, formed, over the circuit board, covering the semiconductor chip;
- a U-like shaped heat spreading layer, formed over the circuit board, comprising a first portion covering a top surface of the encapsulant layer and a second portion embedded in the encapsulant layer;
- and
- a plurality of solder balls, formed over the second surface of the circuit board.
Dependencies are inferred from the claim text.