Integrated circuit package system with bonding in via

An integrated circuit package system comprising:

• a substrate having a conductor and a substrate insulator between a first substrate layer and a second substrate layer, wherein the conductor includes:
• a conductor base portion in contact with a lower surface of the substrate insulator,
• a conductor upper portion partially covered by the first substrate layer and configured to form a perimeter,
• the conductor base portion partially covered by the second substrate layer, and
• conductor intermediate portions extending and from the conductor upper portion to an upper surface of the conductor base portion forming a plurality of contacting interfaces between the conductor intermediate portions and the upper surface of the conductor base portion, wherein the contacting interfaces collective form an exposed area on the conductor base, wherein the exposed area is smaller than the perimeter;
• an integrated circuit die over the substrate;
• a die interconnect attached from the integrated circuit die to an exposed area of the conductor base portion;
• and
• a substrate pad within the second substrate layer, the substrate pad below and in contact with the conductor base portion opposite the exposed area thereof, an exposed bottom surface of the substrate pad is directly below the exposed area of the conductor base portion, the exposed bottom surface of the substrate pad is exposed from a substrate bottom surface providing electrical connectivity to a next level system.

A method for manufacturing an integrated circuit package system comprising:

• forming a substrate having a conductor and a substrate insulator between a first substrate layer and a second substrate layer, wherein the conductor includes:
• a conductor upper portion contacting a top surface of the substrate insulator,
• the conductor upper portion partially covered by the first substrate layer and configured to form a perimeter,
• a conductor base portion partially covered by the second substrate layer,
• conductor intermediate portions extending and tapering from the conductor upper portion to an upper surface of the conductor base portion forming a plurality of contacting interfaces between the conductor intermediate portions and the upper surface of the conductor base portion, wherein the contacting interfaces collectively form an exposed area on the conductor base portion, wherein the exposed area is small than the perimeter,
• the conductor base portion contacting a lower surface of the substrate insulator, and
• the conductor intermediate portions contacting side surfaces of the substrate insulator connecting the conductor upper portion to the conductor base portion;
• attaching an integrated circuit die over the substrate;
• attaching a die interconnect from the integrated circuit die to an exposed area of the conductor base portion;
• and
• forming a substrate pad within the second substrate layer, the substrate pad below and contacting the conductor base portion opposite the exposed area thereof, an exposed bottom surface of the substrate pad is directly below the exposed area of the conductor base portion, the exposed bottom surface of the substrate pad is exposed from a substrate bottom surface providing electrical connectivity to a next level system.

An integrated circuit package system comprising:

• a substrate having a conductor and a substrate insulator between a first substrate layer and a second substrate layer, wherein the conductor includes:
• a conductor upper portion in contact with a top surface of the substrate insulator,
• the conductor upper portion partially covered by the first substrate layer and configured to form a perimeter,
• a conductor base portion partially covered by the second substrate layer, and
• conductor intermediate portions ex from the conductor upper portion to an upper surface of the conductor base portion forming a plurality of contacting interfaces between the conductor intermediate portions and the upper surface of the conductor base portion, wherein the contacting interfaces collectively form an exposed area on the conductor base portion, wherein the exposed area is smaller than the perimeter,
• the conductor base portion in contact with a lower surface of the substrate insulator, and
• the conductor intermediate portions in contact with side surfaces of the substrate insulator connected with the conductor upper portion and the conductor base portion;
• an integrated circuit die over the substrate;
• a die interconnect attached from the integrated circuit die to an exposed area of the conductor base portion;
• and
• a substrate pad within the second substrate layer, the substrate pad below and in contact with the conductor base portion opposite the exposed area, an exposed bottom surface of the substrate pad is directly below the conductor base portion exposed area, the exposed bottom surface of the substrate pad is exposed from a substrate bottom surface providing electrical connectivity to a next level system.