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US 9,000,577 B2Granted
Interlayer communications for 3D integrated circuit stack
AssigneeIntel Corporation
InventorsGuido Droege, Niklas Linkewitsch, Andre Schaefer
Life of this patent
Estimating the term…
Abstract
Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules.
Claims14
An apparatus, comprising:
- two or more stacked die layers with active surfaces facing in the same direction;
- at least one interconnect passing through the two or more stacked die layers and having an associated capacitance;
- and
- at least one receiver on at least one of the stacked die layers and at least one transmitter on at least one of the stacked die layers, wherein the at least one transmitter is coupled to the at least one interconnect through a coupling capacitor, the at least one transmitter and receiver to be coupled to each other through the at least one interconnect via AC coupling, wherein the at least one receiver comprises a feedback keeper circuitry.
1 more element
An apparatus, comprising:
- two or more stacked die layers with active surfaces facing in the same direction;
- at least one interconnect passing through the two or more stacked die layers and having an associated capacitance;
- and
- receivers and transmitters on the two or more stacked die layers, wherein at least one of the receivers is coupled to the at least one interconnect through a coupling capacitor, the transmitters and receivers to be coupled to each other through the at least one interconnect via AC coupling, wherein the at least one receiver comprises a feedback keeper circuitry.
1 more element
Dependencies are inferred from the claim text.