Package structure and manufacturing method thereof

A package structure, comprising:

• a bottom lead frame;
• a top lead frame having a platform and a plurality of outer leads;
• a first conductive element comprising a first terminal, a second terminal and a third terminal, wherein the first conductive element is disposed between the top lead frame and the bottom lead frame, wherein the first terminal of the first conductive element is electrically connected to the bottom lead frame, and the second terminal and the third terminal of the first conductive element are electrically connected to the top lead frame;
• and
• a second conductive element comprising a fourth terminal and a fifth terminal, wherein the second conductive element is disposed between the top lead frame and the bottom lead frame, wherein the fourth terminal of the second conductive element is electrically connected to the bottom lead frame, and the fifth terminal of the second conductive element is electrically connected to the top lead frame;
• wherein the bottom lead frame is located between a first outer lead and a second outer lead of the plurality of outer leads.

A package structure, comprising:

• a bottom lead frame;
• a top lead frame having a platform and a plurality of outer leads;
• a first electronic device comprising a first terminal, a second terminal and a third terminal, wherein the first electronic device is disposed between the top lead frame and the bottom lead frame, wherein the first terminal of the first electronic device is electrically connected to the bottom lead frame, and the second terminal and the third terminal of the first electronic device are electrically connected to the top lead frame;
• and
• a second electronic device comprising a fourth terminal, a fifth terminal and a sixth terminal, wherein the second electronic device is disposed between the top lead frame and the bottom lead frame, wherein the fourth terminal of the second electronic device is electrically connected to the top lead frame, and the fifth terminal and the sixth terminal of the second electronic device are electrically connected to the bottom lead frame.