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US 9,000,571 B2Granted
Surface-mounting light emitting diode device and method for manufacturing the same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorChih-Chen Lai
Life of this patent
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Abstract
An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces the other copper pad. The LED includes two pins and each pin includes a horizontal protrusion and a vertical portion. The LED is mounted on the circuit board between the two copper pads. The solders securely and electrically connect the two pins of the LED with the circuit board.
Claims7
An SMT LED (light emitting diode) device, comprising:
- an LED package comprising two pins each comprising a horizontal protrusion protruding outwardly from a lateral side of the LED package and a vertical protrusion extending downwardly vertically from a bottom surface of the LED package;
- and
- a circuit board carrying the LED package thereon, the circuit board having two copper pads defining a soldering area therebetween, and a top surface of the circuit board is spaced from the bottom surface of the LED package with the vertical protrusion supported therebetween;
- wherein the LED package is received in the soldering area and each of the two horizontal protrusions of the pins of the LED package is secured and electrically connected to a corresponding copper pad by a solder connecting therewith and an inner lateral side of the corresponding copper pad.
1 more element
Dependencies are inferred from the claim text.