Semiconductor structure
AssigneeChipbond Technology Corporation
InventorsChin-Tang Hsieh, You-Ming Hsu, Ming-Sheng Liu, Chih-Ping Wang
Life of this patent
Estimating the term…
Loading patent…
AssigneeChipbond Technology Corporation
InventorsChin-Tang Hsieh, You-Ming Hsu, Ming-Sheng Liu, Chih-Ping Wang
Estimating the term…
A semiconductor structure includes a carrier, a first protective layer, a second protective layer, and a third protective layer. A first surface of the first protective layer comprises a first anti-stress zone. A first extension line from a first bottom edge intersects with a second extension line from a second bottom edge to form a first base point. A first projection line is formed on the first surface, an extension line of the first projection line intersects with the second bottom edge to form a first intersection point, a second projection line is formed on the first surface, and an extension line of the second projection line intersects with the first bottom edge to form a second intersection point. A zone by connecting the first base point, the first intersection point and the second intersection point is the first anti-stress zone.
A semiconductor structure having at least one corner includes:
Dependencies are inferred from the claim text.