Quantum electro-optical device using CMOS transistor with reverse polarity drain implant

A method comprising

• providing a p-type substrate;
• forming a gate dielectric layer on a top surface of the substrate;
• forming a gate on a top surface of the gate dielectric layer;
• forming an n-type source region in the substrate adjacent to and on one side of the gate;
• forming an n-type quantum well region in the substrate adjacent to the gate on an opposite side of the gate from the source region;
• and
• forming a p-type drain region in the substrate abutting the quantum well region on an opposite side of the quantum well region from the gate;
• wherein the method further comprises the step of forming a p-type halo region with a doping density between 1·1017 and 1·1018 cm−3 in the substrate under the gate and abutting the quantum well region;
• in which a width of the quantum well region is less than 15 nanometers;
• in which the step of forming the quantum well region is performed such that a doping density of the quantum well region is above 1·1019 cm−3;
• in which a first electron energy state in the quantum well region is separated from a second electron energy state in the quantum well region by more than 50 meV;
• in which the step of forming a p-type drain region further comprises the steps of:
• forming offset spacers on a lateral surfaces of the gate;
• forming gate sidewall spacers on lateral surfaces of the offset spacers;
• and
• ion implanting a set of p-type dopants into the substrate to form the drain region such that a lateral boundary of the drain region is defined on one side by a boundary of the gate sidewall spacers;
• and
• in which the step of forming an n-type quantum well region is performed concurrently with forming n-type lightly doped drain (NLDD) regions in an NMOS transistor.