FinFET with multiple concentration percentages
AssigneeSTMicroelectronics S.r.l.
InventorPierre Morin
Life of this patent
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Abstract
An apparatus of a semiconductor is provided wherein the apparatus comprises a substrate, a stack, and a fin. The substrate supports the stack and the substrate comprises a first material. The stack provides for the fin and the stack comprises: a strain induced in the stack via the substrate; the first material and a second material; and a plurality of concentrations of the second material with respect to the first material. The fin provides a source and a drain of a field effect transistor.
Claims21
An apparatus of a semiconductor, the apparatus comprising:
- a substrate supporting a stack,
- the substrate comprising a first material;
- the stack providing a fin, the stack comprising:
- a strain induced in the stack via the substrate;
- the first material and a second material;
- and
- a plurality of concentrations, in the fin, of the second material with respect to the first material,
- the fin providing a source and a drain of a field effect transistor.
An apparatus of a semiconductor, the apparatus comprising:
- a substrate supporting a stack;
- the substrate comprising a first material;
- the stack providing a fin, the stack comprising:
- a strain induced in the stack via the substrate;
- the first material and a second material;
- and
- the second material including a plurality of concentrations with respect to the first material;
- the fin providing a source and a drain of a field effect transistor;
- wherein the fin is formed from the stack by etching away one or more portions of the stack;
- wherein a relaxation in the strain of the stack of the fin occurs via the etching;
- and
- wherein the plurality of concentrations compensate for the relaxation.
A method of a semiconductor apparatus, the method comprising:
- supporting, via a substrate, a stack,
- the substrate comprising a first material;
- providing, via the stack, a fin,
- a strain induced in the stack via the substrate, and
- the stack comprising the first material and a second material;
- and
- providing, via the fin, a source and a drain of a field effect transistor,
- the fin formed from the stack by etching away one or more portions of the stack,
- a relaxation in the strain of the stack of the fin via the etching,
- the stack of the fin comprising a plurality of concentrations of the second material with respect to the first material, and
- the plurality of concentrations to compensate for the relaxation.
A fin field effect transistor (FinFET) structure comprising:
- a substrate made of a first material;
- and
- a fin formed overlying the substrate,
- the fin including a second material
- having a non-uniform concentration, from a top layer the fin to a bottom layer of the fin, of the second material with respect to the first material;
- and
- the fin providing a channel of the FinFET.
A fin field effect transistor (FinFET) structure comprising:
- a substrate made of a first material;
- and
- a fin formed the substrate including a second material a non-uniform concentration, from a top layer of the fin to a bottom layer of the fin, of the second material with respect to the first material, the fin providing a channel of a FinFET,
- wherein the fin is formed from a stack by etching away one or more portions of the stack;
- wherein a relaxation in a strain of the stack of the fin is created via the etching;
- and
- wherein the non-uniform concentration compensates for the relaxation.
Dependencies are inferred from the claim text.