Semiconductor package having IC dice and voltage tuners
AssigneeXilinx, Inc.
InventorsThao H. T. Vo, Andy H. Gan, Xiao-Yu Li, Matthew H. Klein
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are coupled to the plurality of IC dice, respectively. A first voltage tuner is coupled to the first IC die, and the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.
Claims14
A semiconductor package, comprising:
- an interposer;
- a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer, a first IC die of the plurality of IC dice having a clock speed rating that is greater than a clock speed rating of another of the IC dice;
- and
- a plurality of programmable voltage tuners disposed in the interposer and coupled to the plurality of IC dice for providing power to the plurality of IC dice, respectively, wherein:
- a first voltage tuner of the plurality of voltage tuners is coupled to the first IC die;
- and
- the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.
A method of building an electronic system, comprising:
- determining respective clock speed ratings of a plurality of IC dice;
- determining respective voltage levels for the plurality of IC dice based on the respective clock speed ratings and a target power profile of the electronic system;
- attaching the IC dice to an interposer having a plurality of voltage tuners disposed in a circuit layer of the interposer for providing power to the plurality of IC dice;
- coupling each of the IC dice on the interposer to a respective one of the plurality of voltage tuners;
- and
- programming each respective voltage tuner to supply the respective voltage level to one of the IC dice on the interposer.
An electronic system, comprising:
- a printed circuit board;
- a semiconductor package mounted on the printed circuit board, wherein the semiconductor package includes:
- a package substrate;
- an interposer disposed on the package substrate;
- and
- a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer, a first IC die of the plurality of IC dice having a clock speed rating that is greater than a clock speed rating of another of the IC dice;
- and
- a plurality of programmable voltage tuners disposed-in a circuit layer of the interposer and coupled to the plurality of IC dice for providing power to the plurality of IC dice, respectively, wherein:
- a first voltage tuner of the plurality of voltage tuners is coupled to the first IC die;
- and
- the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.
Dependencies are inferred from the claim text.