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US 9,000,474 B2Granted
Wiring substrate, light emitting device, and manufacturing method of wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorsShigetsugu Muramatsu, Hiroshi Shimizu, Kazutaka Kobayashi
Life of this patent
Estimating the term…
Abstract
There is provided a wiring substrate. The wiring substrate includes: a heat sink; a first insulating layer on the heat sink; a wiring pattern on the first insulating layer, wherein the wiring pattern is configured to mount a light emitting element thereon; and a second insulating layer on the first insulating layer such that the wiring pattern is exposed from the second insulating layer.
Claims10
A wiring substrate comprising:
- a heat sink;
- a first insulating layer on the heat sink;
- a plurality of wiring patterns on a first surface of the first insulating layer, wherein the wiring patterns are configured to mount light emitting elements thereon, and each wiring pattern includes;
- a first surface,
- a second surface opposite to the first surface of each wiring pattern, the second surface of each wiring pattern facing the first insulating layer, and
- a side surface between the first surface of each wiring pattern and the second surface of each wiring pattern;
- a second insulating layer on the first insulating layer such that the wiring patterns are exposed from the second insulating layer, wherein a surface of the second insulating layer which is opposite to another surface of the second insulating layer with which the first surface of the first insulating layer is in contact is lower than the first surfaces of the wiring patterns, and the second insulating layer covers at least a portion of the side surfaces of the wiring patterns;
- and
- a first reflective layer on the second insulating layer, wherein the first reflective layer covers another portion of the side surfaces of the wiring patterns and the surface of the second insulating layer which is opposite to said another surface of the second insulating layer.
6 more elements
A wiring substrate comprising:
- a heat sink;
- a first insulating layer on the heat sink;
- a plurality of wiring patterns on a first surface of the first insulating layer, wherein the wiring patterns are configured to mount light emitting elements thereon, each wiring pattern includes
- a first surface,
- a second surface opposite to the first surface of each wiring pattern, the second surface of each wiring pattern facing the first insulating layer, and
- a side surface between the first surface of each wiring pattern and the second surface of each wiring pattern,
- the first insulating layer covers a portion of the side surfaces of the wiring patterns, and a surface of the first insulating layer is lower than the first surfaces of the wiring patterns;
- metal layers on the wiring patterns, wherein the metal layers completely cover the first surfaces of the wiring patterns;
- and
- a first reflective layer on the first insulating layer, wherein the first reflective layer covers the remaining portion of the side surfaces of the wiring patterns, and the first reflective layer contacts entire side surfaces of the metal layers, and exposed surfaces of the metal layers are flush with an exposed surface of the first reflective layer.
7 more elements
A wiring substrate comprising:
- a heat sink;
- a first insulating layer on the heat sink;
- a plurality of wiring patterns on the first insulating layer, wherein the wiring patterns are configured to mount light emitting elements thereon, each wiring pattern includes
- a first surface,
- a second surface opposite to the first surface of each wiring pattern, the second surface of the wiring pattern facing the first insulating layer, and
- a side surface between the first surface of each wiring pattern and the second surface of each wiring pattern,
- the first insulating layer covers a portion of the side surfaces of the wiring patterns, and a surface of the first insulating layer is lower than the first surfaces of the wiring patterns;
- and
- a first reflective layer that is formed so as to cover a part of the first surfaces of the wiring patterns, a part of the side surfaces of the wiring patterns, and the surface of the first insulating layer.
6 more elements
Dependencies are inferred from the claim text.