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US 9,000,473 B2Granted
Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
AssigneeSamsung Electronics Co., Ltd.
InventorsEun Sung Lee, Sang Soo Jee, Kun Mo Chu, Se Yun Kim, Kyu Hyoung Lee, Sang Mock Lee
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Abstract
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
Claims8
A heat dissipation material comprising:
- a metallic glass;
- and
- an organic vehicle,
- wherein the metallic glass is an alloy having a disordered atomic structure including two or more metals and has a supercooled liquid region that is a temperature region between a glass transition temperature and a crystallization temperature of the metallic glass, and the metallic glass has a liquid-like behavior in the supercooled liquid region.
1 more element
Dependencies are inferred from the claim text.