Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device

A light-emitting device comprising:

• a substrate having a light-transmitting property with respect to visible light;
• a first adhesive layer over the substrate;
• an insulating layer over the first adhesive layer;
• a transistor over the insulating layer;
• an interlayer insulating layer covering the transistor;
• a light-emitting element comprising a first electrode over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode, the first electrode being electrically connected to a source electrode or a drain electrode of the transistor;
• a second adhesive layer over the second electrode;
• a metal substrate over the second adhesive layer;
• a resin layer over the metal substrate;
• and
• a heat radiation material layer formed over the resin layer,
• wherein the substrate includes an inorganic filler having a particle diameter of 40 nm or less, and
• wherein the heat radiation material layer is a titanium oxide layer, an iron oxide layer, an aluminum oxide layer, a copper oxide layer, or a ceramic material layer.

A light-emitting device comprising:

• a substrate having a light-transmitting property with respect to visible light;
• a first adhesive layer over the substrate;
• an insulating layer over the first adhesive layer;
• a light-emitting element comprising a first electrode formed over the insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode,
• a second adhesive layer over the second electrode;
• a metal substrate having a thickness greater than or equal to 10 μm and less than or equal to 200 μm over the second adhesive layer;
• a resin layer over the metal substrate;
• and
• a heat radiation material layer over the resin layer,
• wherein the substrate includes an inorganic filler having a particle diameter of 40 nm or less.

A light-emitting device comprising:

• a substrate having a light-transmitting property with respect to visible light;
• a first adhesive layer over the substrate;
• an insulating layer over the first adhesive layer;
• a transistor over the insulating layer;
• an interlayer insulating layer covering the transistor;
• a light-emitting element comprising a first electrode over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode, the first electrode being electrically connected to a source electrode or a drain electrode of the transistor;
• a second adhesive layer over the second electrode;
• a metal substrate having a thickness greater than or equal to 10 μm and less than or equal to 200 μm over the second adhesive layer;
• a resin layer over the metal substrate;
• and
• a heat radiation material layer formed over the resin layer,
• wherein the substrate includes an inorganic filler having a particle diameter of 40 nm or less.