Connection substrate

A connection substrate for mounting on one substrate surface thereof a photoelectric conversion device for receiving light from a scintillator for converting radiation made incident from a predetermined direction to light at a plurality of photoelectric conversion regions arrayed two-dimensionally, and mounting on the other substrate surface thereof an integrated circuit device for individually reading out by a plurality of readout circuits electrical signals output from each of the plurality of photoelectric conversion regions of the photoelectric conversion device, comprising:

• a base material formed by stacking a plurality of dielectric layers;
• and
• a plurality of metallic through conductors provided penetrating through at least three dielectric layers adjacent to each other out of the plurality of dielectric layers, and for serving as a part of paths for the electric signals, wherein
• a plurality of metallic radiation shielding films formed integrally with each of the plurality of through conductors and separated from each other are provided at two or more interlayer parts in the at least three dielectric layers, and
• a region of the radiation shielding film formed integrally with one through conductor in one interlayer part projected onto a virtual plane normal to the predetermined direction and a region of another radiation shielding film not formed integrally with said through conductor in said interlayer part projected onto the virtual plane do not overlap each other.