Circuit configuration having a prescribed capacitance, and method and device for the production thereof
AssigneeSmartrac IP B.V.
InventorManfred Michalk
Life of this patent
Estimating the term…
Abstract
The present invention relates to a circuit arrangement (1) having a prescribed electrical capacitance, comprising a substrate (S) having at least one metallic, electrically conductive conductor (L, Lb, Ls). According to the invention, at least one first conductor strip segment (LA1) is disposed on the substrate (S) and at least some regions of at least one second conductor strip segment (LA2, LA3, LA4) are disposed on the first conductor strip segment (LA1), wherein an electrically insulating layer (iS) is disposed between the conductor strip segments (LA1, LA2, LA3, LA4), forming a dielectric. The invention further relates to a method and a device (2) for producing a circuit arrangement (1) having a prescribed electrical capacitance.
Claims16
A method for producing a circuit arrangement having a prescribed electrical capacitance, said method comprising:
- laying at least one metallic, electrically conductive conductor strip having a width of 100 μm to 1000 μm and a thickness of 5 μm to 40 μm on at least one surface side of a substrate;
- laying at least one first conductor strip segment forming part of the at least one conductor strip on the substrate;
- and
- at least partially laying at least one second conductor strip segment forming part of the at least one conductor strip on the first conductor strip segment, wherein an electrically insulating layer is disposed between the conductor strip segments, forming a dielectric, wherein the conductor strip segments are one of 1) partially placed on top of each other selectively and in a defined manner and/or 2) almost completely placed on top of each other, and integrally joined to each other.
A circuit arrangement having a prescribed electrical capacitance, said circuit arrangement comprising:
- a substrate having at least one metallic, electrically conductive conductor strip having a width of 100 μm to 1000 μm and a thickness of 5 μm to 40 μm;
- at least one first conductor strip segment forming part of the at least one conductor strip and disposed on the substrate;
- and
- at least one second conductor strip segment forming part of the at least one conductor strip at least partially disposed on the first conductor strip segment, wherein an electrically insulating layer is disposed between the conductor strip segments, forming a dielectric, the conductor strip segments being one of 1) partially placed on top of each other selectively and in a defined manner and /or 2) almost completely placed on top of each other, and integrally joined to each other.
A device for producing a circuit arrangement-having a prescribed electrical capacitance, said device comprising:
- a substrate positioner positioning a substrate forming the circuit arrangement;
- a laying tool laying at least one first conductor strip segment from a conductor strip coil on the substrate and at least one second conductor strip segment at least partially laid on the first conductor strip segment with an electrically insulating layer disposed between the conductor strip segments, forming a dielectric, and a metallic, electrically conductive conductor strip having a width of 100 μm to 1000 μm and a thickness of 5 μm to 40 μm, wherein the conductor strip segments are one of 1) partially placed on top of each other selectively and in a defined manner and/or 2) almost completely placed on top of each other and integrally joined to each other, and at least one of the laying tool is moved relative to the substrate and the substrate is moved relative to the laying tool by the substrate positioner, wherein the laying tool can be aligned perpendicular to a corresponding substrate segment to be covered with the conductor strip.
Dependencies are inferred from the claim text.