Thermally curable resin composition for protective film

A thermally curable resin composition for a protective film, comprising about 0.5 to about 30% by weight of an alkoxy group-containing silane-modified epoxy resin obtained by reacting an epoxy compound having a silyl group represented by Formula 3 with an alkoxy silane represented by Formula 2 based on a total weight of a solid content, a binder resin and a solvent,

• wherein the binder resin is a copolymer of an epoxy group-containing unsaturated compound, an ethylenic unsaturated compound, and other polymerizable monomers as optional compounds, and
• wherein the binder resin is prepared by copolymerization of 20 to 70% by weight of an epoxy group-containing unsaturated compound, 10 to 40% by weight of an ethylenic unsaturated compound, and 1 to 50% by weight of other polymerizable monomers:
• R1 and R2 are the same or different, and C1 to C6 alkyl groups or C1 to C6 alkoxy groups,
• R3, R4, R5, and R6 are the same or different, and C1 to C6 alkyl groups, and
• R7 is one selected from the group consisting of a C1 to C6 alkyl group, a C2 to C6 vinyl group, a C2 to C6 vinyl alkyl group, a C1 to C6 mercapto alkyl group, and a C6 to C12 aryl group,
• n1 and n2 are each 1 or 2, and n1+n2=3.